HC1S60F1020AG

The HC1S60F1020AG is a HardCopy Stratix structured ASIC device offered in a 1020-BBGA package. It implements the Stratix family architecture and is designed for designs that migrate from Stratix FPGA prototypes to production-optimized HardCopy devices.

This device targets applications that require high logic capacity, substantial embedded memory, and large I/O counts, while operating within a commercial temperature range and standard surface-mount package form factor.

Key Features

• Logic Capacity — 57,120 logic elements (LEs) to support complex digital designs and high integration density.
• Embedded Memory — Total on-chip RAM of 5,215,104 bits (approximately 5.2 Mbits) for buffers, FIFOs, and memory-intensive functions.
• I/O Resources — 782 I/O pins to accommodate broad interfacing and high-pin-count systems.
• Process Technology — Manufactured on a 1.5 V, 0.13 μm all-layer-copper metal fabrication process (up to eight metal layers), consistent with Stratix family devices.
• Power Supply — Core supply voltage range of 1.425 V to 1.575 V for defined power-domain integration.
• Package & Mounting — 1020-BBGA surface-mount package; supplier device package listed as 1020-FBGA (33×33).
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Ecosystem — Part of the HardCopy Stratix family that preserves FPGA functionality and supports pin‑compatible migration from Stratix FPGA prototypes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Prototype-to-Production Migration — Use alongside Stratix FPGA prototypes to migrate verified designs into production-optimized HardCopy devices while preserving pin compatibility.
• High-density Digital Systems — Suitable for complex logic implementations that require tens of thousands of logic elements and multi-megabit on-chip memory.
• High-pin-count Interfaces — Systems requiring large I/O counts such as communication endpoints, board-level aggregators, or multi-interface controllers.
• DSP and Signal Processing — Designs that leverage embedded DSP resources and on-chip memory for fixed-function or mixed-signal processing tasks.

Unique Advantages

• High Logic Integration: 57,120 logic elements enable consolidation of complex subsystems into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 5.2 Mbits of on-chip RAM supports large buffers, FIFOs, and memory-hungry functions without external memory.
• Extensive I/O Capacity: 782 I/Os provide flexibility for multi-protocol interfacing and dense connector implementations.
• Production-focused Process: Manufactured on a 0.13 μm all-layer-copper process consistent with the Stratix family for stable silicon characteristics across production runs.
• Pin-compatible Migration Path: Preserves Stratix FPGA functionality and enables a streamlined path from prototyping to production-optimized HardCopy devices.
• RoHS Compliant & Commercial Grade: Meets RoHS requirements and is specified for commercial-temperature operation, simplifying deployment in standard electronic products.

Why Choose HC1S60F1020AG?

The HC1S60F1020AG provides a high-capacity, production-ready implementation of the Stratix architecture in a 1020-BBGA surface-mount package. With 57,120 logic elements, approximately 5.2 Mbits of embedded RAM, and 782 I/Os, it is well suited for designs that require significant integration, memory resources, and dense interfacing while maintaining a commercial temperature spec.

This device is appropriate for teams moving validated Stratix FPGA designs into production who need a pin-compatible, migration-friendly option that leverages the same Stratix-based process technology and family features. Its combination of logic density, on-chip memory and I/O capability supports scalable, robust system designs with reduced external component requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the HC1S60F1020AG.