HC1S60F1020CA

The HC1S60F1020CA is a HardCopy® Stratix structured ASIC device that preserves the architecture and functionality of corresponding Stratix FPGAs for seamless prototype-to-production migration. This commercial-grade device combines high logic density, substantial embedded memory, and broad I/O capability for designs that move from FPGA verification to low-cost, high-volume production.

Targeted at communications, signal-processing, and high-density digital systems, the HC1S60F1020CA delivers a compact, surface-mount 1020-BBGA package and electrical characteristics suited for mainstream embedded and networking applications.

Key Features

• Core Logic  57,120 logic elements to implement complex digital functions and system logic.
• Embedded Memory  Approximately 5.215 Mbits of on-chip RAM to support FIFOs, buffers, and data-path storage.
• I/O Capacity  782 I/O pins to support dense connectivity and high-channel-count interfaces.
• Package & Mounting  1020-BBGA (supplier package: 1020-FBGA, 33 × 33 mm) in a surface-mount form factor for compact board integration.
• Power Supply  Core voltage range 1.425 V to 1.575 V for consistent supply planning and power budgeting.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Design Family Compatibility  Part of the HardCopy Stratix family; preserves Stratix FPGA functionality and is pin-compatible with corresponding Stratix devices, enabling streamlined migration from FPGA prototypes to structured ASICs.
• Fabrication & Series Features  Built on the HardCopy Stratix series technology with features such as embedded DSP blocks, multiple RAM block sizes, and support for on-chip PLLs (series-level capabilities).
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-speed networking  Implements interfaces and packet-processing engines for equipment that requires dense I/O and embedded memory for buffering and queuing.
• Telecommunications systems  Supports protocol bridging, traffic aggregation, and timing-critical logic using embedded DSP and RAM resources.
• Signal processing  Enables FIR filters, multipliers, and other DSP functions leveraging the device’s embedded memory and DSP-oriented architecture.
• Production migration from FPGA prototypes  Facilitates transition from Stratix FPGA prototypes to a HardCopy structured ASIC with pin compatibility and preserved functionality.

Unique Advantages

• Pin-compatible migration: Preserves Stratix FPGA functionality and pinout to simplify prototype-to-production transitions and reduce redesign risk.
• High integration density: 57,120 logic elements and substantial on-chip RAM reduce external component count and simplify board-level design.
• Extensive I/O: 782 I/O pins provide flexibility for multi-channel interfaces, large bus widths, and complex board topologies.
• Compact surface-mount package: 1020-BBGA (33 × 33 mm) enables high-density PCB implementations while maintaining robust mounting and thermal characteristics.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose HC1S60F1020CA?

The HC1S60F1020CA positions itself as a structured ASIC solution that leverages the Stratix architecture to deliver high logical capacity, on-chip memory, and broad I/O in a production-ready package. Its compatibility with Stratix FPGA prototypes and the HardCopy Stratix family approach allows engineering teams to validate designs on FPGA platforms and migrate to a HardCopy device while preserving functionality and pinout.

This part is suited for teams targeting high-density digital designs, communications equipment, and signal-processing applications where integration, migration efficiency, and predictable electrical characteristics (core voltage and temperature range) are key procurement and engineering considerations.

Request a quote or submit an inquiry to our sales team to discuss volume pricing, availability, and technical support for HC1S60F1020CA.