HC1S30F780NAE

The HC1S30F780NAE is a Stratix® HardCopy® structured ASIC device that preserves the architecture and functionality of high-density Stratix FPGAs. It is intended for designs that move from FPGA prototyping and verification to a low-cost, production-optimized HardCopy implementation.

Built for high-integration applications, this device provides a balance of logic capacity, embedded memory, and a large I/O count while supporting automated migration workflows and established design tools for streamlined production deployment.

Key Features

• Logic Capacity — 32,470 logic elements suitable for mid-density logic integration and complex glue logic implementations.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
• I/O Density — 597 I/O pins to support wide parallel interfaces, multi-channel connectivity, and board-level integration.
• Package & Mounting — 780-ball BGA (FCBGA) package; supplier package specified as 780-FBGA (29×29). Surface-mount device for standard PCB assembly.
• Power and Operating Range — Core supply range 1.425 V to 1.575 V and commercial operating temperature 0 °C to 85 °C.
• Process & Construction — Manufactured on a 1.5-V, 0.13 µm all-layer-copper process with up to eight metal layers as used across HardCopy Stratix devices.
• Architecture Features — Preserves Stratix FPGA architecture and supports TriMatrix memory architecture, embedded high-speed DSP blocks, and up to 12 PLLs as provided across the HardCopy Stratix family.
• Compliance — RoHS compliant and supplied in commercial grade.

Typical Applications

• FPGA-to-ASIC Migration — Seamless migration from Stratix FPGA prototypes to production HardCopy devices while preserving pin-to-pin compatibility and device architecture for faster time-to-market.
• High-density I/O Systems — Interfaces and bridging applications that require a large number of I/Os and embedded memory for buffering and protocol handling.
• Signal Processing and DSP — Implementations leveraging embedded DSP blocks and on-chip RAM for filtering, accumulators, and other fixed-function signal-processing tasks.
• Communications and Networking — Systems requiring moderate logic density, multiple PLLs, and support for high-speed interface standards common to the HardCopy Stratix family.

Unique Advantages

• Architecture Continuity: Preserves Stratix FPGA functionality to simplify validation and reduce migration risk from prototype to production.
• Performance and Power Benefits: HardCopy Stratix devices deliver improved performance and reduced power compared with their FPGA counterparts, enabling more efficient production designs.
• High I/O and Memory Integration: Nearly 600 I/Os and approximately 2.14 Mbits of embedded RAM reduce external component count and simplify board-level design.
• Production-ready Packaging: 780-ball FCBGA surface-mount package provides a compact, assembly-friendly form factor for volume manufacturing.
• Toolchain Support: Compatible with the HardCopy migration flow and Quartus II design tools to streamline automated migration and deployment.
• RoHS-compliant Commercial Grade: Suits standard commercial-temperature production environments while meeting environmental compliance requirements.

Why Choose HC1S30F780NAE?

The HC1S30F780NAE positions itself as a production-focused HardCopy Stratix device for designs that require a mid-range balance of logic, memory, and I/O density. Its retention of Stratix architecture and compatibility with established migration flows make it well suited for teams that prototype on Stratix FPGAs and intend to transition to a production ASIC with predictable performance and power characteristics.

Engineers and procurement teams seeking a commercially graded, RoHS-compliant structured ASIC with robust on-chip memory, DSP resources, and a high I/O count will find the HC1S30F780NAE aligned with production deployment needs while benefiting from vendor-supported design and migration toolchains.

Request a quote or submit an inquiry to receive pricing and availability for the HC1S30F780NAE and to discuss how it fits your production design requirements.