EX64-TQG64

The EX64-TQG64 is a compact field programmable gate array from Microchip Technology designed for commercial embedded applications that require configurable logic and flexible I/O. With 128 logic elements and 41 user I/O pins in a 64-pin LQFP surface-mount package, this FPGA is suited to small to medium complexity control, glue-logic and interface tasks where board space and power efficiency are considerations.

Key Features

• Logic Capacity  Provides 128 logic elements and approximately 3,000 gates for implementing custom combinational and sequential logic functions.
• I/O  Delivers 41 usable I/O pins to support multiple peripheral connections and signal interfacing on compact boards.
• Package & Mounting  Surface-mount 64-LQFP package (supplier device package: 64-TQFP, 10×10 mm) for streamlined PCB assembly and reliable mechanical integration.
• Power  Operates from a 2.3 V to 2.7 V supply range to match common low-voltage system rails.
• Operating Range & Grade  Commercial-grade device rated for operation from 0 °C to 70 °C, suitable for standard commercial environments.
• Environmental Compliance  RoHS-compliant to support modern manufacturing and regulatory needs.

Typical Applications

• Embedded control and glue logic  Use the EX64-TQG64 to implement control sequences and interface logic between processors, sensors, and peripherals where moderate logic density and multiple I/Os are required.
• Sensor and signal interfacing  The 41 I/O pins enable direct connection to a range of sensors and input sources for preprocessing, aggregation, or protocol translation tasks.
• Prototyping and development  Compact package and modest gate/logic element counts make this FPGA well-suited for proof-of-concept designs and small-scale prototyping.

Unique Advantages

• Right-sized logic capacity: 128 logic elements and ~3,000 gates provide balanced resources for moderate-complexity designs without unnecessary overhead.
• Generous I/O density: 41 I/O pins offer flexibility for multi-signal interfacing while keeping PCB footprint small.
• Low-voltage operation: 2.3 V–2.7 V supply compatibility aligns with common low-voltage digital rails, simplifying power-tree design.
• Compact surface-mount package: 64-LQFP (64-TQFP, 10×10 mm) reduces PCB area while enabling standard automated assembly.
• Commercial temperature suitability: Rated 0 °C to 70 °C for a wide range of non-industrial, commercial deployments.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose EX64-TQG64?

The EX64-TQG64 offers a pragmatic balance of logic resources, I/O capability, and a compact, surface-mount package for commercial embedded designs. It fits projects that need configurable logic and interface flexibility without the size or power penalties of larger FPGAs.

Designed and supplied by Microchip Technology, this device is suitable for engineers and procurement teams building small to medium complexity systems who value predictable voltage requirements, modest gate counts, and a commercially rated temperature range.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the EX64-TQG64.