EX64-TQ64A

The EX64-TQ64A is an EX series field programmable gate array (FPGA) IC from Microchip Technology designed for compact, low-voltage embedded logic applications. It provides 128 logic elements and 41 user I/O in a 64-pin LQFP surface-mount package, delivering a balance of integration and footprint efficiency for space-constrained designs.

Engineered and qualified for automotive use with AEC-Q100 certification and an operating temperature range from −40 °C to 125 °C, the device targets applications requiring robust temperature performance and automotive-grade qualification at a 2.3 V to 2.7 V supply level.

Key Features

• Core Logic 128 logic elements providing programmable digital logic capacity suitable for glue logic, protocol adaptation, and small-scale custom logic functions.
• I/O Density 41 user I/O pins to support multiple peripheral connections and interfacing requirements within a single compact device.
• On-chip Resources Approximately 0 bits of embedded RAM as specified; logic centric architecture optimized for combinational and sequential logic implementations.
• Power and Voltage Low-voltage operation from 2.3 V to 2.7 V to match contemporary low-voltage system rails.
• Package and Mounting 64-LQFP (supplier package listed as 64-TQFP 10×10) in a surface-mount form factor for compact PCB placement and automated assembly.
• Automotive Qualification and Reliability Automotive-grade device with AEC-Q100 qualification and specified operating temperature range of −40 °C to 125 °C for deployment in demanding environments.
• Gate Count 3,000 gates of logic capacity for implementing a range of small to moderate digital functions.

Typical Applications

• Automotive systems — AEC-Q100 qualification and automotive grade enable use in vehicle electronics requiring qualified components and extended temperature capability.
• Low-voltage embedded control — 2.3 V to 2.7 V supply compatibility makes the device suitable for designs constrained to low supply rails.
• Compact interface and glue logic — 41 I/O in a 64-LQFP package provides a compact solution for board-level interfacing, protocol conversion, and custom control logic.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 certification and automotive grading provide traceable qualification for vehicle electronics projects.
• Compact integration: 128 logic elements and 41 I/O in a 64-pin LQFP package reduce component count and simplify PCB routing for space-limited designs.
• Low-voltage operation: Native support for 2.3 V–2.7 V systems enables direct integration with low-voltage power domains.
• Wide operating temperature: Rated from −40 °C to 125 °C for reliable operation across extended temperature ranges.
• Surface-mount convenience: 64-LQFP / 64-TQFP (10×10) surface-mount package suits automated assembly and compact board layouts.

Why Choose EX64-TQ64A?

The EX64-TQ64A is positioned for designers who need a compact, automotive-qualified FPGA for implementing moderate logic functions and board-level interfacing within low-voltage systems. Its combination of 128 logic elements, 41 I/O, and AEC-Q100 qualification offers an integrated option for applications demanding qualification, compact packaging, and extended temperature performance.

Choose this device when your design requires a surface-mount FPGA with verified automotive-grade reliability, a small footprint, and compatibility with 2.3 V–2.7 V system rails—providing a straightforward path to implement custom logic and interfacing tasks in constrained form factors.

Request a quote or submit an inquiry to receive pricing and availability information for the EX64-TQ64A.