EX64-TQ64I

The EX64-TQ64I is a Field Programmable Gate Array (FPGA) from Microchip Technology provided in a 64-LQFP surface-mount package. It combines 128 logic elements distributed across 64 logic blocks with up to 41 general-purpose I/O pins, targeting compact, industrial-grade programmable-logic applications.

Designed for operation from 2.3 V to 2.7 V and across an industrial temperature range of −40 °C to 85 °C, this device suits designs that require low-voltage operation, moderate logic capacity, and RoHS-compliant manufacturing.

Key Features

• Core Logic — 128 logic elements organized into 64 logic blocks, representing approximately 3,000 equivalent gates for implementing glue logic and modest programmable functions.
• I/O Density — 41 programmable I/O pins provide balanced external connectivity for sensors, control signals, and peripheral interfaces.
• Power — Operates from a 2.3 V to 2.7 V supply range to support low-voltage system domains.
• Package & Mounting — Available in a 64-LQFP surface-mount package (supplier device package: 64-TQFP 10×10) for compact PCB layouts.
• Industrial Temperature Range — Rated for −40 °C to 85 °C operation to meet industrial-environment requirements.
• Regulatory & Quality — RoHS compliant, suitable for designs requiring lead-free, environmentally compliant components.

Typical Applications

• Industrial Control — Implement control logic, signal conditioning, and small-scale state machines within industrial automation systems operating across an extended temperature range.
• Interface Bridging — Act as a programmable interface or glue logic between microcontrollers, sensors, and peripherals using up to 41 I/O pins.
• Embedded Logic and Custom Peripherals — Provide customizable combinational and sequential logic to add tailored functionality without large discrete component counts.
• Prototyping and Low-density FPGA Tasks — Support evaluation and development of modest programmable-logic functions in a compact surface-mount form factor.

Unique Advantages

• Compact, Surface-mount Package: The 64-LQFP package and 10×10 supplier footprint enable high-density PCB implementations while maintaining serviceability.
• Balanced I/O and Logic Capacity: 41 I/O pins paired with 128 logic elements provide a practical mix for glue logic and simple peripheral offloading.
• Low-voltage Operation: A 2.3 V to 2.7 V supply window supports integration into modern low-voltage systems.
• Industrial Temperature Support: Rated from −40 °C to 85 °C for deployments in industrial environments.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.
• Reputable Manufacturer: Produced by Microchip Technology, offering a recognized source for programmable-logic components.

Why Choose EX64-TQ64I?

The EX64-TQ64I provides a straightforward, industrial-grade FPGA solution where moderate logic capacity and a solid I/O complement are required. Its 128 logic elements, 41 I/Os, and approximately 3,000 gate equivalence make it well suited for designs that need custom logic, interface bridging, or compact programmable control without excess complexity.

With a 64-LQFP surface-mount package, low-voltage operation (2.3 V–2.7 V), and an industrial temperature rating, the EX64-TQ64I is positioned for applications demanding reliable, RoHS-compliant programmable logic in constrained PCB footprints.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EX64-TQ64I.