EX64-TQG64A
| Part Description |
EX Field Programmable Gate Array (FPGA) IC 41 128 64-LQFP |
|---|---|
| Quantity | 245 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 64-TQFP (10x10) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 64-LQFP | Number of I/O | 41 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 64 | Number of Logic Elements/Cells | 128 | ||
| Number of Gates | 3000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 |
Overview of EX64-TQG64A – EX FPGA, 128 logic elements, 41 I/O, 64-LQFP
The EX64-TQG64A is a field programmable gate array (FPGA) IC from Microchip Technology providing a compact, automotive‑grade programmable logic option. It combines 128 logic elements (approximately 3,000 gates) with 41 general-purpose I/O in a 64‑lead LQFP package for small, reliable system designs.
Designed for operation from 2.3 V to 2.7 V and qualified to AEC‑Q100 with an operating temperature range of −40°C to 125°C, the device targets embedded control, I/O expansion and sensor/interface functions where automotive qualification and extended temperature operation are required.
Key Features
- Programmable Logic 128 logic elements supporting around 3,000 equivalent gates for implementing glue logic, state machines and simple control functions.
- I/O Count 41 available I/O pins for flexible interfacing to peripherals, sensors and external devices.
- Memory No on‑chip RAM—suitable for designs that rely on external memory or that implement logic and control functions without embedded memory.
- Power Low‑voltage operation with a supply range of 2.3 V to 2.7 V to match modern low‑voltage systems.
- Package & Mounting 64‑lead LQFP (supplier package: 64‑TQFP, 10×10) in a surface‑mount form factor for space‑conscious PCB layouts.
- Automotive Qualification & Temperature Range AEC‑Q100 qualification and rated for −40°C to 125°C operation for use in temperature‑challenging environments.
- Regulatory RoHS compliant for environmental and manufacturing compliance.
Typical Applications
- Automotive control and interfacing AEC‑Q100 qualification and extended temperature range make the device suitable for sensor interfacing, signal aggregation and low‑complexity control tasks in automotive systems.
- Embedded control and glue logic Use as a compact programmable logic element to implement custom peripheral interfaces, state machines and timing control in embedded electronics.
- Industrial instrumentation Extended temperature rating and robust qualification support deployment in industrial sensor interfaces, monitoring and simple I/O expansion.
Unique Advantages
- Automotive‑grade reliability: AEC‑Q100 qualification combined with −40°C to 125°C operation supports designs that require validated temperature and reliability characteristics.
- Compact, surface‑mount package: 64‑lead LQFP (64‑TQFP 10×10) provides a small footprint solution for board space‑constrained designs.
- Flexible interfacing: 41 I/O pins enable integration with multiple sensors, actuators and peripherals without large external logic arrays.
- Low‑voltage operation: 2.3 V to 2.7 V supply range aligns with modern low‑voltage systems and interfaces.
- Right‑sized logic density: 128 logic elements (≈3,000 gates) are optimized for glue logic, control functions and modest programmable tasks while minimizing part count.
- RoHS compliant: Meets environmental compliance requirements for modern manufacturing processes.
Why Choose EX64-TQG64A?
The EX64-TQG64A is positioned as a compact, automotive‑qualified FPGA for designers seeking a small programmable logic device with robust temperature and qualification credentials. Its combination of 128 logic elements, 41 I/O and a 64‑lead LQFP package delivers a practical balance of integration and board‑level flexibility for embedded control, I/O expansion and sensor interface applications.
Backed by Microchip Technology manufacturing and AEC‑Q100 qualification, the EX64-TQG64A is suited to teams needing a dependable, low‑voltage programmable solution that simplifies designs while meeting automotive and industrial environmental demands.
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