HC1S60F1020BQ
| Part Description |
Stratix® HardCopy® Field Programmable Gate Array (FPGA) IC 782 5215104 57120 1020-BBGA |
|---|---|
| Quantity | 1,339 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 782 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5712 | Number of Logic Elements/Cells | 57120 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5215104 |
Overview of HC1S60F1020BQ – Stratix® HardCopy® Field Programmable Gate Array (FPGA) IC, 57,120 logic elements
The HC1S60F1020BQ is an Intel Stratix® HardCopy® structured ASIC offering the architecture and feature set of Stratix FPGAs in a production-optimized device. It combines high logic density, abundant embedded memory, and a large I/O count in a 1020-BBGA package for commercial applications.
Typical use cases include high-speed networking and communications, DSP- and compute-heavy processing, and designs that migrate from Stratix FPGA prototypes to a fixed, production device. The HardCopy Stratix family is designed to preserve configured Stratix functionality while delivering on-average performance and power benefits versus FPGA prototypes.
Key Features
- Core architecture HardCopy Stratix structured ASIC preserving the functionality of a configured Stratix device and providing pin-compatibility with Stratix counterparts.
- Logic density 57,120 logic elements to implement complex digital designs.
- Embedded memory Approximately 5.2 Mbits of on-chip RAM (5,215,104 total RAM bits) for buffers, FIFOs, and large data structures.
- I/O resources 782 I/O pins supporting a wide range of single-ended and differential I/O standards and high-speed communications interfaces.
- DSP and clocking Embedded high‑speed DSP blocks for multipliers and FIR implementations and support for up to 12 PLLs (enhanced and fast PLLs) for complex clocking schemes.
- Performance and power HardCopy Stratix devices provide, on average, 50% higher performance and up to 40% lower power consumption compared with corresponding Stratix FPGAs.
- Package and mounting 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) with surface-mount mounting for compact PCB integration.
- Electrical and temperature Core supply range 1.425 V to 1.575 V; commercial grade operation from 0 °C to 85 °C.
- Environmental RoHS compliant.
Typical Applications
- High‑speed networking and communications Implement RapidIO, 10G Ethernet XSBI, SPI-4 Phase 2 and other bus protocols using the device’s large I/O count and high-speed interface support.
- Signal processing and DSP Use embedded DSP blocks and plentiful on-chip RAM for FIR filters, multiply‑accumulate pipelines, and real‑time data processing.
- Prototype-to-production migration Migrate verified Stratix FPGA designs to a production-ready HardCopy device while preserving pin compatibility and functionality.
- High-density logic integration Consolidate glue logic, controllers, and protocol handling into a single device leveraging 57,120 logic elements and extensive I/O.
Unique Advantages
- Highly integrated logic and memory: 57,120 logic elements with approximately 5.2 Mbits of embedded RAM reduce the need for external components.
- Extensive I/O capacity: 782 I/O pins simplify board-level partitioning for multi-protocol designs and high-channel counts.
- Production-optimized package: 1020-BBGA (33×33) surface-mount package supports dense board layouts for space-constrained systems.
- Performance and power gains: On-average performance increases and power reductions compared to Stratix FPGA prototypes help meet throughput and efficiency targets.
- Design migration support: Preserves configured FPGA functionality and works within the Quartus II design flow for a streamlined prototype-to-production transition.
- Commercial readiness and compliance: Commercial temperature grade (0 °C to 85 °C) and RoHS compliance for mainstream production environments.
Why Choose HC1S60F1020BQ?
The HC1S60F1020BQ positions itself as a production-focused implementation of the Stratix architecture, combining high logic density, substantial on-chip memory, and a large I/O complement in a compact 1020-BBGA package. It is suited to teams moving from Stratix FPGA prototypes to a fixed, production device while retaining architectural parity and pin compatibility.
Backed by the HardCopy Stratix design methodology and Quartus II tooling, the device supports automated migration from Stratix FPGA prototypes to production HardCopy devices, enabling predictable timelines and a consolidated design flow for performance-sensitive and power-conscious applications.
Request a quote or submit a quote request for HC1S60F1020BQ to receive pricing and availability details tailored to your production needs.

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