HC1S60F1020CB
| Part Description |
Stratix® HardCopy® Field Programmable Gate Array (FPGA) IC 782 5215104 57120 1020-BBGA |
|---|---|
| Quantity | 671 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 782 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5712 | Number of Logic Elements/Cells | 57120 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5215104 |
Overview of HC1S60F1020CB – Stratix HardCopy structured ASIC, 57,120 logic elements, ~5.2 Mbits RAM, 782 I/Os, 1020-BBGA
The HC1S60F1020CB is a HardCopy Stratix structured ASIC that preserves the functionality of the corresponding Stratix FPGA family while offering a production-optimized implementation. It delivers a pin-compatible migration path from Stratix FPGA prototypes to a HardCopy device, enabling designers to translate verified FPGA designs into a lower-power, higher-performance production device.
With 57,120 logic elements, approximately 5.2 Mbits of embedded memory, and 782 I/Os in a 1020-BBGA package, this commercial-grade device targets high-density, high-I/O applications where production cost, power and performance efficiency are important. The device is RoHS compliant and operates at a supply range of 1.425 V to 1.575 V and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Structured ASIC core (HardCopy Stratix) Preserves the functionality of a configured Stratix device and supports migration from Stratix FPGA prototypes using the same package pinout.
- Logic capacity 57,120 logic elements to implement high-density designs.
- Embedded memory Approximately 5.2 Mbits of on-chip RAM to support buffers, FIFOs and data storage requirements, using the TriMatrix memory architecture described for the family.
- High I/O count 782 I/Os to support dense board-level interfaces and multi-channel I/O requirements.
- DSP and timing resources Family-level support includes embedded high-speed DSP blocks and up to 12 PLLs per device for clock management and phase control.
- Package and mounting 1020-BBGA (supplier package 1020-FBGA, 33×33) in a surface-mount form factor for high pin-count board designs.
- Power and operating conditions Supply voltage range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
- Standards and I/O support Family-level support for numerous single-ended and differential I/O standards and a range of high-speed networking/communications standards.
- Environmental RoHS compliant.
Typical Applications
- Production migration for FPGA-prototyped designs Convert verified Stratix FPGA designs to a HardCopy device for production while preserving pin compatibility.
- Networking and communications equipment High I/O density and family support for high-speed interface standards enable multi-channel line cards and packet-processing boards.
- Signal processing and DSP systems Embedded DSP resources and substantial on-chip RAM support real-time filtering, accumulation and data buffering tasks.
- High-density embedded controllers Large logic and memory resources in a compact BGA package for space-constrained, high-functionality boards.
Unique Advantages
- Pin-compatible migration: Preserves the same package pinout as the Stratix FPGA counterparts to simplify board reuse between prototype and production.
- Integrated memory and logic: 57,120 logic elements combined with approximately 5.2 Mbits of embedded RAM reduce external memory requirements and simplify system design.
- High I/O density: 782 I/Os support complex multi-interface designs and dense connectivity on modern boards.
- Performance and power benefits: Family-level migration yields improved performance and power efficiency compared with the corresponding FPGAs as part of the HardCopy Stratix approach.
- Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
- Design flow compatibility: The HardCopy Stratix family is supported by the Quartus II design flow for prototyping and migration to production.
Why Choose HC1S60F1020CB?
The HC1S60F1020CB positions itself as a production-ready HardCopy Stratix device for designs that started on Stratix FPGAs and require a streamlined migration to a structured ASIC. Its combination of 57,120 logic elements, approximately 5.2 Mbits of embedded memory, and 782 I/Os in a 1020-BBGA package delivers the integration and I/O bandwidth needed for dense, I/O-heavy applications while maintaining a controlled power and supply profile.
Designed for teams seeking a direct path from FPGA prototype to production, this device leverages the HardCopy Stratix family architecture and Quartus II design flow to reduce design iterations, improve power and performance metrics, and simplify volume deployment under commercial operating conditions.
Request a quote or submit a purchase inquiry to begin procuring HC1S60F1020CB for your production designs.

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