HC20K600FC672AC

The HC20K600FC672AC is an Intel APEX HardCopy field-programmable gate array (FPGA) device optimized for high-density, high-volume applications. It implements HardCopy APEX device technology that preserves the functionality of configured APEX 20KE/20KC devices and supports automated migration from those programmable devices for production cost reduction.

This device provides a balanced combination of logic, embedded memory, and I/O in a compact 672-ball BGA package, making it suitable for designs that require significant integration while operating within a commercial temperature range and low-voltage core supply.

Key Features

• Core Logic — Approximately 24,320 logic elements (LEs) delivering roughly 600,000 typical gates for medium-to-high density logic integration.
• Embedded Memory — Approximately 311,296 bits of embedded memory for on-chip storage and buffer functions.
• I/O Capacity — 488 device I/O pins to support diverse peripheral and system interfaces.
• Clock and Timing — Series documentation indicates support for up to four phase-locked loops (PLLs) and flexible clock management features for multi-clock designs.
• High-speed Interfaces — Series-level features include support for LVDS channels and for high-speed external memories such as DDR, SDRAM, and ZBT SRAM.
• Power Supply — Core voltage supply range specified at 1.71 V to 1.89 V to match low-voltage system designs.
• Package & Mounting — 672-ball BGA (supplier package: 672-FBGA 27 × 27) with surface-mount mounting type for compact PCB integration.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

• High-volume production ASIC replacement — Use as a cost-effective migration target from APEX 20KE/20KC programmable devices for volume manufacturing.
• Memory controller and buffering — On-chip embedded memory (≈0.31 Mbits) and series support for DDR/SDRAM/ZBT interfaces enable memory-intensive subsystems.
• High-speed serial and differential I/O — Series-level LVDS channel support suits multi-channel, low-noise data links and receiver/transmitter functions.
• System integration and logic consolidation — ~24k logic elements allow consolidation of glue logic, interface bridging, and mid-density processing functions into a single device.

Unique Advantages

• Functionality preservation during migration — HardCopy APEX devices preserve configured APEX 20KE/20KC functionality to simplify transfer from programmable prototypes to production devices.
• Automated migration flow — The migration process from APEX programmable devices to HardCopy APEX is automated using Quartus II software-generated outputs, reducing manual redesign effort.
• Compact, production-ready package — 672-ball BGA surface-mount packaging provides a high-density footprint for space-constrained PCBs.
• Low-voltage core operation — Defined core supply range of 1.71 V to 1.89 V supports modern low-voltage system architectures.
• RoHS compliance — Manufactured to meet RoHS requirements for regulatory and environmental considerations.

Why Choose HC20K600FC672AC?

The HC20K600FC672AC positions itself as a practical choice for designs that need to move from programmable prototype devices to a production-optimized HardCopy APEX implementation while maintaining functional compatibility. With approximately 24,320 logic elements, roughly 311,296 bits of embedded memory, and a dense 672-BBGA package, it targets mid-to-high density applications that require integration, compact packaging, and a controlled commercial temperature range.

Design teams planning volume deployments or consolidating system logic will find value in the device’s automated migration flow and preserved functionality, which reduce time-to-production and redesign overhead while ensuring predictable electrical and thermal operating envelopes.

If you would like pricing, availability, or a quote for HC20K600FC672AC, please submit a request to our sales team and specify your required quantities and lead-time expectations.