ICE40HX4K-BG121

The ICE40HX4K-BG121 is an industrial-grade iCE40™ HX family FPGA from Lattice Semiconductor. It provides a compact, surface-mount FPGA option in a 121-TFBGA (9×9) package with 93 I/O pins and an on-chip configuration option.

Built on the iCE40 LP/HX family architecture, this device targets embedded and system applications that require flexible I/O, on-chip memory, and low-power operation within an industrial temperature range.

Key Features

• Core Logic  Approximately 3,520 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 81,920 bits of on-chip RAM (sysMEM/EBR) for data buffering and small-footprint storage.
• I/O Capacity & Flexibility  93 programmable I/O pins; family-level programmable sysIO buffers support LVCMOS 3.3/2.5/1.8, LVDS25E and subLVDS signaling, programmable pull-ups, and DDR registers in I/O cells.
• Clocking  Family architecture provides eight low-skew global clock resources and up to two analog PLLs per device for flexible on-chip clock generation and distribution.
• Low Power  Built on a 40 nm low-power process with family-level standby currents as low as 21 μA, and a device supply range of 1.14 V to 1.26 V.
• Configuration Options  SRAM configuration via standard SPI or internal Non-volatile Configuration Memory (NVCM) as supported by the iCE40 family.
• Package & Mounting  121-TFBGA package (supplier device package: 121-caBGA, 9×9), surface-mount mounting type.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C.
• Additional Family Features  Family includes programmable low-swing differential I/Os, high-current LED drivers on select devices, and a range of package options.

Typical Applications

• Industrial control and monitoring  Industrial-grade temperature range and flexible I/O make the ICE40HX4K-BG121 suitable for control logic, protocol bridging, and sensor interfacing.
• Embedded systems  On-chip RAM and 3,520 logic elements support small to mid-size embedded processing, state machines, and glue logic integration.
• User interfaces and LED control  Family-level high-current LED drivers and programmable I/O enable LED indicators, RGB LED control, and simple UI tasks (where available on the family).
• Low-power devices  Low standby current and a 1.14–1.26 V supply range support applications where low-power operation is important.

Unique Advantages

• Compact, surface-mount package:  121-TFBGA (9×9) offers a PCB-friendly footprint for space-constrained designs.
• Industrial temperature capability:  Rated −40 °C to 100 °C for deployment in industrial environments.
• Flexible I/O and signaling:  Programmable sysIO buffers and support for multiple logic families and differential standards simplify interface design.
• Integrated memory and clocking:  On-chip RAM plus multiple global clocks and PLL options reduce external component needs for many embedded tasks.
• Low supply voltage and standby:  1.14–1.26 V supply and family-level low standby currents enable lower-power system designs.

Why Choose ICE40HX4K-BG121?

The ICE40HX4K-BG121 combines the iCE40 HX family architecture with 3,520 logic elements, approximately 81,920 bits of embedded RAM, and 93 flexible I/Os in a compact 121-TFBGA package. Its industrial temperature rating and low-voltage operation make it well suited for embedded and system applications that require reliable operation across a wide temperature range.

Design teams looking for a compact, low-power FPGA option with on-chip memory, flexible I/O signaling, and family-level clocking and configuration options will find the ICE40HX4K-BG121 a practical choice for reducing external components and accelerating time-to-market.

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