ICE40HX4K-BG121TR
| Part Description |
iCE40™ HX Field Programmable Gate Array (FPGA) IC 93 81920 3520 121-TFBGA |
|---|---|
| Quantity | 476 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 121-caBGA (9x9) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 121-TFBGA | Number of I/O | 93 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE40HX4K-BG121TR – iCE40™ HX Field Programmable Gate Array (FPGA) IC 93 81920 3520 121-TFBGA
The ICE40HX4K-BG121TR is an iCE40™ HX series FPGA in a 121‑TFBGA package, offering 3,520 logic elements, approximately 80 kbits of embedded RAM, and 93 user I/Os. Built for low-power, configurable logic and flexible I/O, this industrial‑grade device supports designs that require compact programmable logic with on-chip configuration options.
Key value propositions include a low-power 40 nm architecture, on-chip configuration memory and SPI configuration support, and industrial operating range for deployment in temperature‑sensitive environments.
Key Features
- Core Logic 3,520 logic elements (LUT + flip‑flop) for implementing combinational and sequential logic.
- Embedded Memory Approximately 80 kbits of on‑chip RAM (sysMEM™ Embedded Block RAM) to support buffers, FIFOs and small data tables.
- I/O Flexibility 93 programmable I/O pins with support for low‑swing differential and multiple interface standards as provided by the iCE40 family architecture.
- Low Power Architecture Fabricated on a 40 nm low power process with family features that include ultra‑low standby currents (family documented as low as 21 μA).
- Clocking and PLLs Up to two analog PLLs per device and multiple low‑skew global clock resources as part of the iCE40 family clocking architecture.
- Configuration Options On‑chip nonvolatile configuration memory (NVCM) plus standard SPI configuration support for flexible boot and reconfiguration flows.
- Package 121‑TFBGA (121‑caBGA, 9×9 mm) surface‑mount package optimized for PCB integration.
- Voltage and Temperature Operating supply range 1.14 V to 1.26 V and industrial temperature rating from −40 °C to 100 °C.
- Regulatory RoHS compliant.
Typical Applications
- Consumer and System Electronics Low‑cost, high‑volume consumer and system products that require compact programmable logic and flexible I/O.
- Industrial Embedded Control Industrial control and monitoring equipment that benefit from on‑chip configuration memory and extended temperature operation.
- LED and Indicator Driving Designs leveraging the iCE40 family’s high‑current LED driver capabilities for simple RGB or multi‑LED indicators.
- Interface Bridging Protocol or interface conversion and simple glue logic between components using the device’s programmable I/O and embedded memory.
Unique Advantages
- Compact, PCB‑Friendly Package: 121‑TFBGA (9×9) surface‑mount package simplifies board layout while providing a high pin count.
- Flexible Configuration: On‑chip NVCM plus SPI configuration enables secure and flexible boot strategies without additional external configuration hardware.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature‑sensitive environments.
- Integrated Memory and Logic: Approximately 80 kbits of embedded RAM combined with 3,520 logic elements reduces external memory needs for many control and buffering tasks.
- Low Power Operation: Built on a 40 nm low‑power process and family‑documented low standby current characteristics to support energy‑conscious designs.
- Rich I/O Capability: 93 user I/Os and family I/O features provide versatility for mixed signal interfaces and differential signaling options.
Why Choose ICE40HX4K-BG121TR?
The ICE40HX4K-BG121TR positions itself as a compact, industrial‑grade FPGA solution that balances programmable logic capacity, embedded memory and flexible I/O in a low‑power 40 nm architecture. It is suitable for designers who need on‑board configurability, moderate logic density (3,520 logic elements) and an extended operating temperature range.
For projects that require reduced BOM complexity, on‑chip configuration, and a small footprint package, this device offers a practical blend of integration and ruggedness backed by the iCE40 family features.
Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for the ICE40HX4K-BG121TR. Our team can assist with ordering details and configuration options.