ICE40HX8K-BG121

The ICE40HX8K-BG121 is an iCE40™ HX-series FPGA offered in a 121-TFBGA package with surface-mount mounting. It provides a flexible logic architecture with 7,680 logic elements, embedded memory, and a broad set of programmable I/O options suitable for low-power and compact embedded designs.

Designed for low-power consumer and system applications as well as industrial environments, this device combines on-chip configuration options, programmable I/O standards, and multiple clocking resources to simplify integration and accelerate time-to-market.

Key Features

• Logic Capacity — 7,680 logic elements (cells) for mid-density programmable logic and glue-logic implementations.
• Embedded Memory — Approximately 128 kbits of on-chip RAM to support FIFOs, small data buffers, and control structures.
• I/O Count and Flexibility — 93 programmable I/Os with support for a wide range of interface standards through programmable sysIO buffers.
• Low-Power Architecture — Built on an advanced 40 nm low-power process with standby currents as low as 21 μA (family data) for energy-sensitive applications.
• Programmable I/O Standards — sysIO buffer support for multiple interfaces including LVCMOS 3.3/2.5/1.8, LVDS25E, subLVDS and Schmitt trigger inputs (per family datasheet).
• Clocking and PLLs — Eight low-skew global clock resources and up to two analog PLLs per device to support complex timing and source-synchronous interfaces.
• Configuration Options — SRAM configuration via standard SPI interface or internal Nonvolatile Configuration Memory (NVCM) for flexible boot and field updates.
• Industrial Operating Range — Rated operating temperature from −40 °C to 100 °C and listed as Industrial grade for robust deployment.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V for stable core operation.
• Package — 121-TFBGA (121-caBGA, 9×9) surface-mount package for compact PCB integration.

Typical Applications

• Portable and Battery-Powered Devices — Low standby currents and configurable I/O make the device suitable for energy-conscious consumer electronics and portable instrumentation.
• Consumer and System Electronics — Mid-density logic and embedded RAM support glue logic, protocol bridging, and custom functions in high-volume consumer products.
• LED and User Interface Control — Family-level support for high-current LED drivers (family datasheet) and flexible I/O allow RGB or multi-LED control and status indicators.
• Industrial Embedded Systems — Industrial temperature rating and flexible configuration options support control, sensor interfacing, and system glue logic in industrial applications.

Unique Advantages

• Balanced Logic and Memory — 7,680 logic elements combined with ~128 kbits of embedded RAM provide balanced resources for mid-complexity designs.
• Low-Power Operation — Advanced low-power process and documented low standby current reduce system power consumption for always-on and battery applications.
• Versatile I/O and Interfaces — Programmable sysIO buffers support multiple voltage standards and differential I/O modes, simplifying interface design across domains.
• Flexible Configuration — Internal NVCM and standard SPI configuration enable reliable boot options and field reconfiguration without external management circuitry.
• Robust Operating Range — Industrial-grade temperature support (−40 °C to 100 °C) and a compact 121-TFBGA package enable deployment in constrained and demanding environments.
• Integrated Clocking — Multiple global clocks and up to two PLLs provide deterministic timing resources for source-synchronous and high-performance interface needs.

Why Choose ICE40HX8K-BG121?

The ICE40HX8K-BG121 positions itself as a mid-density, low-power FPGA option for engineers who need a compact, configurable logic fabric with on-chip memory and flexible I/O. Its combination of 7,680 logic elements, approximately 128 kbits of embedded RAM, and a comprehensive set of clocking and configuration options makes it well suited for consumer, industrial, and portable system designs that require reliable operation across a wide temperature range.

Supported by the iCE40 family design ecosystem and configuration choices (SPI and NVCM), the device offers a practical path to reduce board-level complexity and accelerate development while maintaining robust field configurability and power efficiency.

Request a quote or submit an inquiry for pricing and availability to begin integrating the ICE40HX8K-BG121 into your next design.