ICE40HX8K-CM225

The ICE40HX8K-CM225 is an iCE40™ HX field-programmable gate array offering 7,680 logic elements in a compact 225-ball VFBGA package. As a member of the iCE40 family, this HX device provides a high-density, low-power FPGA fabric with embedded memory and flexible I/O for consumer, industrial, and system-level designs.

Designed for applications that require moderate logic capacity, substantial on-chip RAM and broad I/O, the device combines approximately 131,072 bits of embedded memory with up to 178 I/O pins, support for programmable I/O standards, and low standby power from a 40 nm low-power process.

Key Features

• Core Logic 7,680 logic elements (LUTs + flip-flops) provide the programmable fabric for custom logic, state machines and glue logic.
• Embedded Memory Approximately 131,072 bits of on-chip RAM (sysMEM/Embedded Block RAM) for data buffering, FIFOs, and small on-chip storage needs.
• I/O and Interfaces Up to 178 programmable I/O pins with support for a wide range of interface standards and programmable sysIO buffer options including multiple LVCMOS voltages and differential modes.
• Clocking and Timing Family features include multiple low-skew global clock resources and support for up to two analog PLLs to implement clock multiplication, deskewing and source-synchronous interfaces.
• Low Power Operation Built on an advanced 40 nm low-power process with standby currents reported as low as 21 μA for minimal idle power consumption.
• Package and Thermal 225-VFBGA package (supplier device package: 225-UCBGA, 7×7 mm) in a surface-mount format, with an industrial operating temperature range of −40 °C to 100 °C.
• Supply and Assembly Core supply range 1.14 V to 1.26 V; surface-mount mounting suitable for compact PCB implementations and volume production.
• Compliance RoHS-compliant lead-free device construction.

Typical Applications

• Consumer electronics — Implement glue logic, custom peripherals and protocol adaptation in low-cost, high-volume consumer devices using the on-chip RAM and flexible I/O.
• IoT and edge devices — Use the low-power standby characteristics and programmable interfaces for sensor aggregation, data conditioning and local protocol bridging.
• Industrial control and instrumentation — Deploy in industrial designs requiring an industrial temperature range and configurable I/O for sensor and actuator interfacing.
• Embedded system glue logic — Offload glue logic, bus translation and timing-critical handshakes from a host processor using the device’s logic density and clocking resources.

Unique Advantages

• High logic density in a small footprint — 7,680 logic elements in a 225-ball VFBGA provide significant integration without a large PCB area impact.
• Substantial on-chip RAM — Approximately 131 kb of embedded memory reduces the need for external RAM for many buffering and small-data tasks.
• Flexible, programmable I/O — Wide-ranging I/O support lets you implement multiple interface standards and differential signaling from a single device.
• Low standby power — Fabricated on a low-power 40 nm process with standby currents reported as low as 21 μA, helping extend battery life in portable applications.
• Industrial temperature range — Rated for −40 °C to 100 °C for reliable operation in thermally demanding environments.
• Production-ready packaging — Surface-mount 225-VFBGA / 225-UCBGA (7×7 mm) package aligns with automated assembly and high-volume manufacturing.

Why Choose ICE40HX8K-CM225?

ICE40HX8K-CM225 delivers a balanced combination of logic capacity, on-chip memory and flexible I/O in an industrial-grade, compact VFBGA package. Its low-power silicon, PLL-based clocking options and broad I/O support make it suitable for designers who need reliable, production-ready FPGA functionality without external configuration complexity.

This device is well suited to engineers building consumer, industrial or embedded systems that require scalable logic, local buffering and configurable interfaces while operating across a wide temperature range. The iCE40 family ecosystem and on-chip features help simplify board-level design and system integration.

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