ICE40HX8K-CT256
| Part Description |
iCE40™ HX Field Programmable Gate Array (FPGA) IC 206 131072 7680 256-LFBGA |
|---|---|
| Quantity | 1,098 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 960 | Number of Logic Elements/Cells | 7680 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of ICE40HX8K-CT256 – iCE40 HX FPGA, 7,680 Logic Elements, 206 I/Os
The ICE40HX8K-CT256 is an industrial-grade iCE40™ HX family Field Programmable Gate Array (FPGA) supplied in a 256-LFBGA package. It provides 7,680 logic elements and 131,072 bits of on-chip RAM to support mid-density programmable logic and embedded memory requirements.
Designed for low-power, flexible I/O and dependable operation across a wide temperature range, this device is suited for control, sensing, and I/O-heavy embedded systems that require reconfigurable logic and compact packaging.
Key Features
- Logic Capacity 7,680 logic elements (LUTs + flip-flops) for mid-density FPGA designs and complex glue logic integration.
- Embedded Memory 131,072 bits of on-chip RAM (approximately 128 kbits) for buffering, small FIFOs, and state storage.
- High I/O Count Up to 206 programmable I/O pins to support extensive sensor, actuator, and peripheral interfacing.
- Configurable I/O Standards Family architecture includes programmable low-swing differential and standard I/O buffer support for a range of interfaces and signaling levels.
- Clocking and PLLs Flexible on-chip clocking with multiple global clock resources and support for up to two analog PLLs per device for phase-locked clock management.
- Low Power Operation Built on an advanced 40 nm low-power process with standby current as low as 21 µA (family data) to minimize static power in battery-assisted or low-power applications.
- Configuration Options Supports SRAM configuration via standard SPI interface and internal Nonvolatile Configuration Memory (NVCM) for flexible boot and reconfiguration models.
- Industrial Temperature and Supply Rated for operation from −40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V, suitable for industrial embedded environments.
- Package 256-LFBGA (supplier package: 256-CABGA, 14 × 14 mm) to balance PCB area and thermal performance in compact designs.
- Compliance RoHS compliant for environmental regulatory requirements.
Typical Applications
- Industrial Control I/O aggregation, protocol bridging and real-time logic tasks where the −40 °C to 100 °C rating and 206 I/Os support multiple sensors and actuators.
- Embedded System Glue Logic Offload timing-critical control, parallel interfaces and custom peripherals using 7,680 logic elements and on-chip RAM for temporary data storage.
- Communications and Interface Bridging Implement interface conversions, serializer/deserializer logic and clocking schemes using the device’s flexible I/O and on-chip PLL resources.
- Industrial Instrumentation Signal conditioning, data capture and preprocessing in compact systems that benefit from low standby power and a compact 256-LFBGA package.
Unique Advantages
- Mid-density programmability: 7,680 logic elements provide a balance of capacity for reasonably complex designs without the cost or power of larger FPGAs.
- On-chip RAM for local buffering: 131,072 bits of embedded memory reduce external memory dependence for many control and data-logging tasks.
- Extensive I/O flexibility: 206 I/Os enable integration of numerous peripherals and interfaces directly on-chip, simplifying board-level design.
- Robust clocking options: Multiple global clocks and up to two analog PLLs support precise timing and high-performance interface requirements.
- Industrial temperature range: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
- Compact packaging: 256-LFBGA (14 × 14 mm) provides high I/O density in a space-efficient form factor for constrained PCBs.
Why Choose ICE40HX8K-CT256?
The ICE40HX8K-CT256 is positioned for engineers who need a low-power, mid-density FPGA with ample I/O and embedded memory in a compact, industrial-temperature package. Its combination of 7,680 logic elements, approximately 128 kbits of on-chip RAM, and flexible clocking/configuration options makes it suitable for control, interfacing, and embedded logic tasks where reliability and thermal range matter.
This device delivers a practical balance of integration and configurability for volume designs that require reprogrammable logic, on-chip memory, and a wide range of I/O — backed by family-level low-power and configuration capabilities.
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