ICE40HX8K-CT256

IC FPGA 206 I/O 256CABGA
Part Description

iCE40™ HX Field Programmable Gate Array (FPGA) IC 206 131072 7680 256-LFBGA

Quantity 1,098 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs960Number of Logic Elements/Cells7680
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of ICE40HX8K-CT256 – iCE40 HX FPGA, 7,680 Logic Elements, 206 I/Os

The ICE40HX8K-CT256 is an industrial-grade iCE40™ HX family Field Programmable Gate Array (FPGA) supplied in a 256-LFBGA package. It provides 7,680 logic elements and 131,072 bits of on-chip RAM to support mid-density programmable logic and embedded memory requirements.

Designed for low-power, flexible I/O and dependable operation across a wide temperature range, this device is suited for control, sensing, and I/O-heavy embedded systems that require reconfigurable logic and compact packaging.

Key Features

  • Logic Capacity  7,680 logic elements (LUTs + flip-flops) for mid-density FPGA designs and complex glue logic integration.
  • Embedded Memory  131,072 bits of on-chip RAM (approximately 128 kbits) for buffering, small FIFOs, and state storage.
  • High I/O Count  Up to 206 programmable I/O pins to support extensive sensor, actuator, and peripheral interfacing.
  • Configurable I/O Standards  Family architecture includes programmable low-swing differential and standard I/O buffer support for a range of interfaces and signaling levels.
  • Clocking and PLLs  Flexible on-chip clocking with multiple global clock resources and support for up to two analog PLLs per device for phase-locked clock management.
  • Low Power Operation  Built on an advanced 40 nm low-power process with standby current as low as 21 µA (family data) to minimize static power in battery-assisted or low-power applications.
  • Configuration Options  Supports SRAM configuration via standard SPI interface and internal Nonvolatile Configuration Memory (NVCM) for flexible boot and reconfiguration models.
  • Industrial Temperature and Supply  Rated for operation from −40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V, suitable for industrial embedded environments.
  • Package  256-LFBGA (supplier package: 256-CABGA, 14 × 14 mm) to balance PCB area and thermal performance in compact designs.
  • Compliance  RoHS compliant for environmental regulatory requirements.

Typical Applications

  • Industrial Control  I/O aggregation, protocol bridging and real-time logic tasks where the −40 °C to 100 °C rating and 206 I/Os support multiple sensors and actuators.
  • Embedded System Glue Logic  Offload timing-critical control, parallel interfaces and custom peripherals using 7,680 logic elements and on-chip RAM for temporary data storage.
  • Communications and Interface Bridging  Implement interface conversions, serializer/deserializer logic and clocking schemes using the device’s flexible I/O and on-chip PLL resources.
  • Industrial Instrumentation  Signal conditioning, data capture and preprocessing in compact systems that benefit from low standby power and a compact 256-LFBGA package.

Unique Advantages

  • Mid-density programmability: 7,680 logic elements provide a balance of capacity for reasonably complex designs without the cost or power of larger FPGAs.
  • On-chip RAM for local buffering: 131,072 bits of embedded memory reduce external memory dependence for many control and data-logging tasks.
  • Extensive I/O flexibility: 206 I/Os enable integration of numerous peripherals and interfaces directly on-chip, simplifying board-level design.
  • Robust clocking options: Multiple global clocks and up to two analog PLLs support precise timing and high-performance interface requirements.
  • Industrial temperature range: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
  • Compact packaging: 256-LFBGA (14 × 14 mm) provides high I/O density in a space-efficient form factor for constrained PCBs.

Why Choose ICE40HX8K-CT256?

The ICE40HX8K-CT256 is positioned for engineers who need a low-power, mid-density FPGA with ample I/O and embedded memory in a compact, industrial-temperature package. Its combination of 7,680 logic elements, approximately 128 kbits of on-chip RAM, and flexible clocking/configuration options makes it suitable for control, interfacing, and embedded logic tasks where reliability and thermal range matter.

This device delivers a practical balance of integration and configurability for volume designs that require reprogrammable logic, on-chip memory, and a wide range of I/O — backed by family-level low-power and configuration capabilities.

Request a quote or submit a purchase inquiry to receive pricing and availability for the ICE40HX8K-CT256.

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