ICE40HX8K-CB132
| Part Description |
iCE40™ HX Field Programmable Gate Array (FPGA) IC 95 131072 7680 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 652 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 95 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 960 | Number of Logic Elements/Cells | 7680 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of ICE40HX8K-CB132 – iCE40™ HX FPGA, 7,680 Logic Elements, ~128 kbits RAM, 95 I/Os, 132-LFBGA/CSPBGA
The ICE40HX8K-CB132 is an industrial-grade iCE40™ HX field-programmable gate array (FPGA) in a 132-LFBGA / CSPBGA package. It provides 7,680 logic elements, approximately 128 kbits of embedded block RAM, and up to 95 programmable I/O pins in a compact 132-CSBGA (8×8) package footprint.
Designed for low-power system and consumer applications, the device combines a flexible logic architecture, programmable I/O options and on-chip configuration memory to support compact, efficient designs across a wide operating range and supply window.
Key Features
- Core Logic 7,680 logic elements (LUT + flip-flop) providing the programmable logic resources for user designs.
- Embedded Memory Approximately 128 kbits of sysMEM™ embedded block RAM for data buffering, FIFOs and small on-chip storage.
- I/O Flexibility Up to 95 I/O pins with programmable sysIO™ buffers supporting multiple standards including LVCMOS (3.3/2.5/1.8 V), LVDS25E, subLVDS and Schmitt-trigger inputs; programmable pull-up mode available.
- Low-Power Operation Built on a 40 nm low-power process with family-level standby currents reported as low as 21 μA; programmable low-swing differential I/Os help reduce dynamic power.
- Clocking and Timing Eight low-skew global clock resources and support for up to two analog PLLs enable flexible on-chip clock generation and low-skew distribution.
- Configuration Options SRAM configuration via standard SPI interface or internal Nonvolatile Configuration Memory (NVCM) for reliable boot and field updates.
- Peripherals and I/O Enhancements Pre‑engineered source synchronous I/O with DDR registers in I/O cells and three high-current LED drivers (suitable for three separate LEDs or one RGB LED).
- Supply and Temperature Specified supply voltage range: 1.14 V to 1.26 V. Operating temperature range: −40 °C to 100 °C for industrial environments.
- Packaging 132-LFBGA / CSPBGA package (supplier device package: 132-CSBGA, 8×8) for compact board integration.
Typical Applications
- Low-power consumer electronics Use the ICE40HX8K-CB132 for compact, battery-sensitive designs that require programmable logic and embedded memory.
- User interface and LED control On-chip high-current LED drivers and flexible I/O make the device suitable for driving multiple LEDs or an RGB LED and handling UI logic.
- High-density I/O and interface bridging Programmable sysIO buffers and source synchronous I/O with DDR registers support a range of serial and parallel interface requirements.
- Industrial embedded systems Industrial temperature rating (−40 °C to 100 °C) and compact BGA packaging support space-constrained industrial designs.
Unique Advantages
- Compact, programmable logic+ 7,680 logic elements with embedded RAM allow consolidation of glue logic and small accelerators into a single device, reducing BOM and board area.
- Flexible, standards‑aware I/O sysIO™ support for LVCMOS and differential standards simplifies interfacing to sensors, level-shifted domains and differential links without external PHYs.
- Low standby and dynamic power 40 nm low-power process and programmable I/O swing help minimize idle and active power consumption for power-sensitive products.
- On-chip configuration options Internal NVCM plus SPI configuration support allows reliable standalone operation or easy integration with external masters.
- Industrial operating range Wide temperature rating and a defined supply window support deployment in industrial environments where thermal and supply conditions vary.
- Built-in timing resources Multiple global clocks and up to two PLLs facilitate precise clocking schemes for synchronous interfaces and data capture.
Why Choose ICE40HX8K-CB132?
The ICE40HX8K-CB132 is positioned for designers who need a compact, industrial-grade FPGA with substantial logic capacity, flexible I/O standards and on-chip memory—all in a small 132-LFBGA/CSPBGA package. Its low-power architecture and on-chip configuration options make it suitable for designs that require robust standalone operation and efficient power management.
Choose this device when your design requires a balance of programmable logic density, mixed I/O support and an industrial operating range, while keeping board space and component count to a minimum. The ICE40 HX family-level features—embedded RAM, PLLs, programmable I/O and NVCM—provide a scalable foundation for cost-sensitive, high-volume and industrial applications.
Request a quote or submit your requirements to receive pricing and availability information for the ICE40HX8K-CB132.