ICE40HX8K-CB132

IC FPGA 95 I/O 132CSBGA
Part Description

iCE40™ HX Field Programmable Gate Array (FPGA) IC 95 131072 7680 132-LFBGA, CSPBGA

Quantity 652 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O95Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs960Number of Logic Elements/Cells7680
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of ICE40HX8K-CB132 – iCE40™ HX FPGA, 7,680 Logic Elements, ~128 kbits RAM, 95 I/Os, 132-LFBGA/CSPBGA

The ICE40HX8K-CB132 is an industrial-grade iCE40™ HX field-programmable gate array (FPGA) in a 132-LFBGA / CSPBGA package. It provides 7,680 logic elements, approximately 128 kbits of embedded block RAM, and up to 95 programmable I/O pins in a compact 132-CSBGA (8×8) package footprint.

Designed for low-power system and consumer applications, the device combines a flexible logic architecture, programmable I/O options and on-chip configuration memory to support compact, efficient designs across a wide operating range and supply window.

Key Features

  • Core Logic  7,680 logic elements (LUT + flip-flop) providing the programmable logic resources for user designs.
  • Embedded Memory  Approximately 128 kbits of sysMEM™ embedded block RAM for data buffering, FIFOs and small on-chip storage.
  • I/O Flexibility  Up to 95 I/O pins with programmable sysIO™ buffers supporting multiple standards including LVCMOS (3.3/2.5/1.8 V), LVDS25E, subLVDS and Schmitt-trigger inputs; programmable pull-up mode available.
  • Low-Power Operation  Built on a 40 nm low-power process with family-level standby currents reported as low as 21 μA; programmable low-swing differential I/Os help reduce dynamic power.
  • Clocking and Timing  Eight low-skew global clock resources and support for up to two analog PLLs enable flexible on-chip clock generation and low-skew distribution.
  • Configuration Options  SRAM configuration via standard SPI interface or internal Nonvolatile Configuration Memory (NVCM) for reliable boot and field updates.
  • Peripherals and I/O Enhancements  Pre‑engineered source synchronous I/O with DDR registers in I/O cells and three high-current LED drivers (suitable for three separate LEDs or one RGB LED).
  • Supply and Temperature  Specified supply voltage range: 1.14 V to 1.26 V. Operating temperature range: −40 °C to 100 °C for industrial environments.
  • Packaging  132-LFBGA / CSPBGA package (supplier device package: 132-CSBGA, 8×8) for compact board integration.

Typical Applications

  • Low-power consumer electronics  Use the ICE40HX8K-CB132 for compact, battery-sensitive designs that require programmable logic and embedded memory.
  • User interface and LED control  On-chip high-current LED drivers and flexible I/O make the device suitable for driving multiple LEDs or an RGB LED and handling UI logic.
  • High-density I/O and interface bridging  Programmable sysIO buffers and source synchronous I/O with DDR registers support a range of serial and parallel interface requirements.
  • Industrial embedded systems  Industrial temperature rating (−40 °C to 100 °C) and compact BGA packaging support space-constrained industrial designs.

Unique Advantages

  • Compact, programmable logic+  7,680 logic elements with embedded RAM allow consolidation of glue logic and small accelerators into a single device, reducing BOM and board area.
  • Flexible, standards‑aware I/O  sysIO™ support for LVCMOS and differential standards simplifies interfacing to sensors, level-shifted domains and differential links without external PHYs.
  • Low standby and dynamic power  40 nm low-power process and programmable I/O swing help minimize idle and active power consumption for power-sensitive products.
  • On-chip configuration options  Internal NVCM plus SPI configuration support allows reliable standalone operation or easy integration with external masters.
  • Industrial operating range  Wide temperature rating and a defined supply window support deployment in industrial environments where thermal and supply conditions vary.
  • Built-in timing resources  Multiple global clocks and up to two PLLs facilitate precise clocking schemes for synchronous interfaces and data capture.

Why Choose ICE40HX8K-CB132?

The ICE40HX8K-CB132 is positioned for designers who need a compact, industrial-grade FPGA with substantial logic capacity, flexible I/O standards and on-chip memory—all in a small 132-LFBGA/CSPBGA package. Its low-power architecture and on-chip configuration options make it suitable for designs that require robust standalone operation and efficient power management.

Choose this device when your design requires a balance of programmable logic density, mixed I/O support and an industrial operating range, while keeping board space and component count to a minimum. The ICE40 HX family-level features—embedded RAM, PLLs, programmable I/O and NVCM—provide a scalable foundation for cost-sensitive, high-volume and industrial applications.

Request a quote or submit your requirements to receive pricing and availability information for the ICE40HX8K-CB132.

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