ICE40HX4K-CB132

The ICE40HX4K-CB132 from Lattice Semiconductor is an iCE40™ HX family FPGA delivered in a 132-LFBGA / CSPBGA package. It provides 3,520 logic elements, approximately 81.9 kbits of on-chip RAM, and up to 95 programmable I/Os in a surface-mount 132-CSBGA (8×8) package footprint.

Designed on a 40 nm low-power process, the device targets low-power, compact system designs and consumer/system applications that require flexible I/O, on-chip memory, and integrated clocking resources while operating across an industrial temperature range.

Key Features

• Logic Capacity — 3,520 logic elements to implement moderate-density glue logic, control state machines, and small datapaths.
• Embedded Memory — Approximately 81.9 kbits of on-chip RAM (sysMEM/EBR) for buffering, FIFOs, and small data stores.
• Programmable I/O — Up to 95 I/O pins with programmable sysIO buffer options and support for low-swing differential interfaces and DDR registers in I/O cells.
• Clocking and PLLs — Integrated clocking resources with up to two analog PLLs for flexible clock management.
• Ultra-Low-Power Architecture — Built on a 40 nm low-power process with family-level standby currents cited as low as 21 μA, enabling low static power operation.
• Flexible Configuration — SRAM configuration supported through a standard SPI interface or internal Nonvolatile Configuration Memory (NVCM) for flexible boot options.
• Package and Mounting — 132-LFBGA (CSPBGA) surface-mount package; supplier device package listed as 132-CSBGA (8×8).
• Industrial Temperature Range — Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Supply Voltage — Core supply range specified at 1.14 V to 1.26 V for power budgeting and supply design.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Consumer and System Devices — Compact programmable logic for low-cost, high-volume consumer and system applications where small size and low power matter.
• Interface and I/O Bridging — Use the device’s programmable I/O and DDR/I/O register features to implement protocol bridging, level translation, and custom interface logic.
• Embedded Control and Glue Logic — 3,520 logic elements and embedded RAM provide sufficient resources for control planes, state machines, and peripheral aggregation.
• Clocking-Dependent Designs — Integrated PLLs enable flexible clock generation and distribution for timing-critical system interfaces.

Unique Advantages

• Balanced Logic and Memory: Combines 3,520 logic elements with approximately 81.9 kbits of embedded RAM to implement mixed logic-plus-buffer designs without external RAM.
• Flexible I/O Options: Up to 95 programmable I/Os with support for low-swing differential signaling and DDR registers, simplifying high-speed interface implementation.
• Low-Power Silicon: 40 nm low-power process and family-level standby currents as low as 21 μA reduce idle power for battery-aware and energy-conscious designs.
• On-Chip Clocking: Up to two analog PLLs provide on-chip clock management, reducing BOM and external clocking complexity.
• Industrial Reliability: Rated for operation from −40 °C to 100 °C and supplied in a robust surface-mount CSPBGA package for rugged system environments.
• Flexible Configuration Paths: Supports standard SPI configuration and internal NVCM for versatile system boot and provisioning strategies.

Why Choose ICE40HX4K-CB132?

The ICE40HX4K-CB132 delivers a compact, low-power FPGA option with a practical balance of logic capacity, embedded memory, and flexible I/O in a 132-LFBGA package. Its clocking resources and configuration flexibility make it appropriate for designs that require on-chip PLLs, programmable interface support, and efficient power usage across industrial temperature ranges.

This device is well suited for engineering teams building compact consumer or industrial systems that need reliable programmable logic to implement control, interface bridging, and moderate-density datapath functions while minimizing board area and power consumption.

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