Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AFS32V234CMN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,977
FS32V234CON1VUBFS32V234CON1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,045
N/AFS32V234CON1VUBRNXP SemiconductorsISP GPU CSE 1GHZ 4 COMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1 GHz
Voltage – I/O:
1 V
Core Processor:
ARM® Cortex®-M4, ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2
Ethernet:
1 Gbps + IEEE 1588 + AVB
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Qualification:
Industrial
389
N/AFS32V234CON2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,149
N/AFS32V234CON2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
248
N/AFS32V234CTN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
681
N/AFS32V234CTN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
572
FSA1153UCXN/AFSA1153UCXonsemiIC SWITCH DP3T X 1 2OHM 12WLCSPAnalog Switches, Multiplexers, Demultiplexers12-WLCSP (1.41x1.575)N/A-40°C ~ 85°C (TA)
Switch Circuit:
DP3T
Multiplexer/Demultiplexer Circuit:
3:1
Number of Circuits:
1
On-State Resistance (Max):
2Ohm
Channel-to-Channel Matching (ΔRon):
200mOhm (Max)
Voltage – Supply, Single (V+):
2.7V ~ 5.5V
Switch Time (Ton, Toff) (Max):
80µs, 400ns (Typ)
-3db Bandwidth:
500MHz
Channel Capacitance (CS(off), CD(off)):
2.5pF, 7pF
Current – Leakage (IS(off)) (Max):
100nA
Crosstalk:
-120dB @ 1kHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
12-UFBGA, WLCSP
Supplier Device Package:
12-WLCSP (1.41×1.575)
443
FSA1156L6XFSA1156L6XonsemiIC SW SPST-NOX1 900MOHM 6MICROPKAnalog Switches, Multiplexers, Demultiplexers6-MicroPakN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-MicroPak
602
FSA1156P6FSA1156P6onsemiIC SWITCH SPST-NOX1 900MOHM SC88Analog Switches, Multiplexers, DemultiplexersSC-88 (SC-70-6)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SC-88 (SC-70-6)
1,098
FSA1156P6XFSA1156P6XonsemiIC SWITCH SPST-NOX1 900MOHM SC88Analog Switches, Multiplexers, DemultiplexersSC-88 (SC-70-6)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SC-88 (SC-70-6)
577
FSA1157L6XFSA1157L6XFairchild SemiconductorIC SW SPST-NCX1 900MOHM 6MICROPKAnalog Switches, Multiplexers, Demultiplexers6-MicroPakN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-MicroPak
449
FSA1157L6XFSA1157L6XonsemiIC SW SPST-NCX1 900MOHM 6MICROPKAnalog Switches, Multiplexers, Demultiplexers6-MicroPakN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-MicroPak
381
FSA1157P6FSA1157P6onsemiIC SWITCH SPST-NCX1 900MOHM SC88Analog Switches, Multiplexers, DemultiplexersSC-88 (SC-70-6)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SC-88 (SC-70-6)
1,720
FSA1157P6XFSA1157P6XonsemiIC SWITCH SPST-NCX1 900MOHM SC88Analog Switches, Multiplexers, DemultiplexersSC-88 (SC-70-6)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
20ns, 30ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SC-88 (SC-70-6)
1,210
FSA1256AL8XFSA1256AL8XonsemiIC SW SPST-NOX2 1.15OHM 8MICROPKAnalog Switches, Multiplexers, Demultiplexers8-MicroPak™N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
1.15Ohm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
2.7V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35ns, 15ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
11.5pF
Current – Leakage (IS(off)) (Max):
2nA (Typ)
Crosstalk:
-100dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-UFQFN
Supplier Device Package:
8-MicroPak™
126
FSA1256L8XFSA1256L8XonsemiIC SW SPST-NOX2 1.15OHM 8MICROPKAnalog Switches, Multiplexers, Demultiplexers8-MicroPak™N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
1.15Ohm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35ns, 15ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
11.5pF
Current – Leakage (IS(off)) (Max):
2nA (Typ)
Crosstalk:
-100dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-UFQFN
Supplier Device Package:
8-MicroPak™
538
FSA1256L8X_F113FSA1256L8X_F113onsemiIC SW SPST-NOX2 1.15OHM 8MICROPKAnalog Switches, Multiplexers, Demultiplexers8-MicroPak™N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
1.15Ohm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.65V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35ns, 15ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
11.5pF
Current – Leakage (IS(off)) (Max):
2nA (Typ)
Crosstalk:
-100dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-UFQFN
Supplier Device Package:
8-MicroPak™
920
FSA1257AL8XFSA1257AL8XonsemiIC SW SPST-NCX2 1.15OHM 8MICROPKAnalog Switches, Multiplexers, Demultiplexers8-MicroPak™N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
1.15Ohm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
2.7V ~ 5.5V
Switch Time (Ton, Toff) (Max):
35ns, 15ns
-3db Bandwidth:
300MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
11.5pF
Current – Leakage (IS(off)) (Max):
2nA (Typ)
Crosstalk:
-100dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-UFQFN
Supplier Device Package:
8-MicroPak™
1,960
FSA1257L8XFSA1257L8XFairchild SemiconductorLOW RON LOW VOLTAGE DUAL-SPST ANAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

1,448

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