H54G46CYRBX267
| Part Description |
LPDDR4/LPDDR4X 2GB (2CH 1CS) 4266Mbps 1.8V/1.1V/0.6V 200-Ball FBGA |
|---|---|
| Quantity | 9,600 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | SK Hynix |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 200-FBGA (10×15) | Memory Format | DRAM | Technology | LPDDR4/LPDDR4X | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 GB | Access Time | 3.5 ns | Grade | Commercial | ||
| Clock Frequency | 2133 MHz | Voltage | 0.57V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | −25°C – 85°C | Write Cycle Time Word Page | 18 ns | Packaging | 200-FBGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 2 × 512M × 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.28 |
Overview of H54G46CYRBX267 – 2GB LPDDR4/4X Commercial DRAM
The H54G46CYRBX267 is an SK hynix 2 GB dual-mode LPDDR4/LPDDR4X SDRAM supporting both standards in a single device. Organized as a dual-channel, single-chip-select device (2CH 1CS), each channel on an 8 Gb × 16 die delivers up to 4266 Mbps over a 16-bit data bus — offering design flexibility for platforms targeting either LPDDR4 or LPDDR4X interfaces.
In LPDDR4 mode VDD2 and VDDQ operate at a combined 1.1V; in LPDDR4X mode VDDQ drops to 0.6V for lower I/O power. This low power DRAM is JEDEC-compliant, RoHS compliant, lead-free, and halogen-free in a 200-ball FBGA (10 mm × 15 mm) for commercial −25°C to 85°C operation.
Key Features
- Dual-Mode LPDDR4 and LPDDR4X in One Device
Supports both LPDDR4 (VDD2/VDDQ = 1.1V) and LPDDR4X (VDDQ = 0.6V) operation, allowing one part to serve LPDDR4 and LPDDR4X designs and simplifying procurement and SKU management. - 4266 Mbps Double-Data-Rate Interface
Two data accesses per clock cycle at up to 4266 Mbps (tCK(avg) min = 0.468 ns); single-data-rate command/address over 6-bit CA bus; differential clock CK_t/CK_c and bi-directional differential strobes DQS_t/DQS_c. - Dual-Channel x16 Architecture — 2 GB
Two independent 8 Gb × 16 channels each with 16-bit bus DQ[15:0], differential strobe pairs DQS[1:0]_t/_c, and two DMI pins per channel for write data masking and Data Bus Inversion (DBIdc). - Flexible Dual Voltage Supply
LPDDR4: VDD1 = 1.8V (1.70V–1.95V), VDD2 = VDDQ = 1.1V (1.06V–1.17V). LPDDR4X: VDD1 = 1.8V, VDD2 = 1.1V, VDDQ = 0.6V (0.57V–0.65V) for lower I/O power in mobile SoC and embedded DRAM platforms. - Programmable ODT, ZQ Calibration, and Burst Control
Programmable CA ODT and DQ ODT with VSSQ termination (MR11, MR22); DQ ODT RZQ/1–RZQ/6 (240Ω–40Ω) with VOH-compensated output driver; background ZQ calibration; burst length 16 (default), 32, and on-the-fly; programmable RL/WL across FSP[0] and FSP[1]. - Advanced Refresh — Auto TCSR, Per-Bank, and PASR
All-bank and directed per-bank auto refresh; Auto Temperature Compensated Self Refresh (Auto TCSR); Partial Array Self Refresh (PASR) with bank mask (MR16) and segment mask (MR17) to minimize refresh area and standby power. - 200-Ball FBGA — 10 mm × 15 mm, RoHS, Lead-Free, Halogen-Free
0.80/0.65 mm pitch, 1.00 mm max height; RoHS compliant, lead-free, halogen-free LPDDR4/LPDDR4X BGA for space-constrained consumer and embedded board designs.
Typical Applications
- Mobile SoCs and Consumer Electronics
4266 Mbps dual-channel bandwidth and dual LPDDR4/LPDDR4X compatibility suit mobile application processors, smartphones, tablets, and consumer devices where interface flexibility and throughput are priorities. - Embedded Computing and Industrial IoT
PASR, Auto TCSR, and −25°C to 85°C range support embedded DRAM in industrial IoT gateways, networking equipment, and edge computing nodes needing low power DRAM. - Communications and Networking
Dual-mode support and high-bandwidth dual-channel architecture suit network processors, wireless infrastructure, and communications SoCs requiring high-throughput memory.
Unique Advantages
- One part covers both LPDDR4 and LPDDR4X designs: Dual-mode operation reduces SKU complexity, simplifying supply chain and platform reuse across LPDDR4 and LPDDR4X systems.
- Frequency Set Point (FSP) switching: Dual FSPs enable atomic switch of timing, ODT, and Vref via a single MRW command for zero-gap DVFS in mobile and embedded SoCs.
- On-chip DQS Interval Oscillator: Tracks DQS delay drift for adaptive re-training only when needed, reducing system overhead.
- Post Package Repair (PPR): Electrical-fuse-based repair of one failed row per bank per channel enables field yield recovery without package replacement.
Why Choose H54G46CYRBX267?
The H54G46CYRBX267 combines SK hynix LPDDR4/LPDDR4X dual-mode memory with 4266 Mbps dual-channel bandwidth, flexible 1.1V/0.6V VDDQ supply, PASR, Auto TCSR, FSP switching, and Post Package Repair in a 200-ball FBGA — a versatile low power DRAM solution for consumer electronics, embedded computing, industrial IoT, and communications platforms requiring LPDDR4 or LPDDR4X compatibility.
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