FM6HZ8G8GXDZB(2H)

The FM6HZ8G8GXDZB(2H) is a multi-chip package (MCP) that integrates NAND Flash and LPDDR4x SDRAM in a compact surface-mount footprint. The assembly combines volatile and non-volatile memory technologies to deliver a total memory capacity of 8.59 Gbit with parallel interface connectivity and a high clock frequency of 2.133 GHz.

Targeted at commercial-grade board-level designs, this MCP provides a space-efficient memory solution in a 9.5 × 8 mm, 149-ball package with an operating range of 0 °C to 70 °C and RoHS compliance.

Key Features

• Integrated Memory Technology MCP combining NAND Flash and LPDDR4x SDRAM to provide both non-volatile and volatile storage in a single package.
• Total Capacity 8.59 Gbit aggregate memory size available in the module.
• Memory Organization 256M × 16 × 2 die organization as specified for the SDRAM portion of the package.
• Performance Clock frequency rated at 2.133 GHz and a write cycle time (word/page) of 15 ns for responsive memory operations.
• Electrical Supply Product name indicates 1.8V memory devices; voltage supply is specified at 2.5V in the product data.
• Interface Parallel memory interface suitable for board-level integration where parallel DRAM/NAND access is required.
• Package & Mounting Surface-mount 9.5 × 8 mm package with 149 balls (supplier device package 9.5 × 8 (mm),149ball) for compact PCB layouts.
• Commercial Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• Compliance RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Commercial embedded systems — Integrated NAND + DRAM MCP for compact board designs requiring both volatile and non-volatile memory.
• Space-constrained PCBs — 9.5 × 8 mm, 149-ball surface-mount package suited to dense PCB layouts.
• Systems requiring moderate operating temperature — Designed for use in applications operating within 0 °C to 70 °C.
• Parallel-memory architectures — Parallel interface and 256M × 16 × 2 organization support designs that use parallel memory access.

Unique Advantages

• Highly integrated MCP: Combines NAND Flash and LPDDR4x SDRAM in one package to reduce board area and simplify BOM.
• Balanced volatile and non-volatile capacity: 8.59 Gbit total memory with both memory types to address mixed storage needs in a single component.
• Compact package size: 9.5 × 8 mm, 149-ball surface-mount package enables tighter PCB layouts and higher component density.
• Commercial temperature suitability: Rated for 0 °C to 70 °C to match a wide range of commercial applications.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing standards.
• Predictable performance markers: Documented 2.133 GHz clock frequency and 15 ns write cycle time for integration planning and timing analysis.

Why Choose FM6HZ8G8GXDZB(2H)?

The FM6HZ8G8GXDZB(2H) positions itself as a compact, integrated memory solution for commercial applications that need both volatile and non-volatile storage on a single surface-mount package. With a combined memory capacity of 8.59 Gbit, a parallel interface, and documented timing and frequency characteristics, it simplifies hardware design where board space and component consolidation are priorities.

This MCP is suited to engineers and procurement teams designing commercial-grade systems within a 0 °C to 70 °C operating window who require a RoHS-compliant, compact memory package with defined electrical and timing specs.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the FM6HZ8G8GXDZB(2H) MCP. Our team can provide procurement and integration assistance tailored to your project requirements.