FM6HZ4G8GXDZB (2H)

The FM6HZ4G8GXDZB (2H) is a multi-chip package (MCP) memory device from ESMT that integrates non-volatile NAND Flash and volatile LPDDR4x SDRAM in a single surface-mount package. The device pairs a 4Gb NAND Flash element with an 8Gb LPDDR4x SDRAM element to deliver combined storage and working memory in a compact footprint.

Designed for industrial-grade applications, this MCP provides a parallel memory interface, RoHS compliance, and an extended operating temperature range of -40°C to 85°C. The combination of NAND and DRAM in one package targets space-constrained embedded systems and industrial designs that benefit from integrated memory subsystems.

Key Features

• Memory Architecture  Combines 4Gb NAND Flash (4.295 Gbit) with 8Gb LPDDR4x SDRAM in an MCP configuration that supports both volatile and non-volatile storage.
• Memory Organization  LPDDR4x organized as 256M × 16 × 2 die, providing the stated DRAM capacity and die configuration.
• Performance Parameters  Clock frequency listed at 2.133 GHz and a write cycle time (word/page) of 15 ns as provided in the product specifications.
• Interface  Parallel memory interface suitable for integrated memory subsystem designs.
• Power  Product name indicates 1.8V device operation; the product specification lists a voltage supply of 2.5V.
• Package & Mounting  Surface-mount MCP in a 9.5 × 8 mm package with 149 balls, enabling compact board-level integration.
• Industrial Grade & Temperature Range  Grade: Industrial; operating temperature range from -40°C to 85°C for deployment in industrial environments.
• Environmental Compliance  RoHS compliant, addressing common environmental requirements for industrial electronics.

Typical Applications

• Industrial Embedded Systems  Integrated NAND and DRAM provide on-board firmware storage and working memory for controllers and embedded appliances operating across industrial temperature ranges.
• Storage-Plus-Working-Memory Modules  MCP configuration is suited to compact modules that require both non-volatile firmware or data storage and volatile system memory in a single package.
• Space-Constrained Industrial Devices  9.5×8 mm, 149-ball package supports designs where board area and component count must be minimized.

Unique Advantages

• Highly Integrated Solution: Combining NAND Flash and LPDDR4x SDRAM in one MCP reduces component count and simplifies board-level memory integration.
• Industrial Temperature Support: Rated for -40°C to 85°C, enabling deployment in a wide range of industrial environments.
• Compact Ball-Grid Package: 9.5×8 mm, 149-ball surface-mount package minimizes PCB footprint for space-limited designs.
• Clear Performance Specs: Documented clock frequency of 2.133 GHz and a 15 ns write cycle time provide specific, verifiable performance parameters for system design.
• Regulatory Compliance: RoHS compliance supports environmental requirements in industrial product development.

Why Choose FM6HZ4G8GXDZB (2H)?

FM6HZ4G8GXDZB (2H) is positioned as an industrial-grade, integrated memory solution for designs that require both non-volatile NAND storage and high-density DRAM in a single, compact package. Its MCP architecture, defined memory organization, and documented operating range make it suitable for embedded and industrial applications where board space, component consolidation, and temperature resilience are important.

Manufactured by ESMT as part of the NAND Base MCP series, this device offers a combination of verifiable memory capacity, package density, and environmental compliance that supports deployment in production systems requiring consistent specification-driven components.

Request a quote or submit an inquiry to receive pricing and availability for FM6HZ4G8GXDZB (2H) and to discuss how this MCP can fit your industrial memory requirements.