FM6HZ4G4GXB

The FM6HZ4G4GXB from ESMT is a Multi-Chip Package (MCP) that integrates NAND flash and LPDDR4x SDRAM in a single surface-mount device. The module combines volatile and non-volatile memory into a compact MCP (NAND + DRAM) format to support designs that require both storage and working memory.

Targeted for commercial-grade applications, the FM6HZ4G4GXB delivers a consolidated memory footprint with defined electrical, timing and package characteristics suitable for space-constrained boards and standard temperature-range deployments.

Key Features

• Integrated MCP (NAND + DRAM) — Combines non-volatile NAND flash and volatile LPDDR4x SDRAM in a single package to simplify board-level memory integration.
• Memory Capacity & Organization — Memory size listed as 4.295 Gbit with organization documented as 256M × 16, matching the combined memory architecture of the module.
• Performance — Clock frequency specified at 2.133 GHz and a write cycle time (word page) of 15 ns provide defined timing characteristics for system design.
• Interface — Parallel memory interface for standard board-level connectivity.
• Power References — Product name denotes 1.8V NAND and 1.8V LPDDR4x components; specifications list a Voltage Supply value of 2.5V. Use these documented values when validating system power domains.
• Package & Mounting — 9.5 × 8 mm, 149-ball MCP package; surface-mount mounting type for compact PCB placement.
• Commercial Temperature Grade — Operating temperature range of 0°C to 70°C and commercial grade classification for standard-environment applications.
• Compliance — RoHS-compliant component for regulatory alignment in commercial products.

Typical Applications

• Embedded memory subsystems — Use as a consolidated NAND + DRAM memory block where both non-volatile storage and volatile working memory are required on a single package.
• Consumer electronic devices — Suited to compact consumer designs that need integrated flash and LPDDR4x SDRAM within a small 9.5 × 8 mm footprint.
• Commercial industrial equipment — Applicable to commercial-temperature-range equipment that benefits from a single-package memory solution and surface-mount assembly.

Unique Advantages

• Highly integrated solution: Combines NAND flash and LPDDR4x SDRAM in one MCP to reduce board-level component count.
• Defined timing and clocking: Documented 2.133 GHz clock frequency and 15 ns write cycle time provide clear parameters for memory subsystem timing.
• Compact package: 9.5 × 8 mm, 149-ball package enables dense placement and saves PCB area.
• Commercial-grade readiness: 0°C to 70°C operating range and commercial grade classification align with standard-environment product requirements.
• RoHS compliant: Meets RoHS requirements for lead-free manufacturing and regulatory consistency.

Why Choose FM6HZ4G4GXB?

The FM6HZ4G4GXB positions integration and predictable memory performance at the center of memory subsystem design. With a documented clock frequency, write timing, and memory organization, designers gain a consolidated NAND + LPDDR4x package that simplifies BOM and PCB layout for commercial applications.

Manufactured by ESMT and offered in a compact 9.5 × 8 mm, 149-ball surface-mount package, this MCP is suitable for projects that prioritize integration, space savings, and RoHS compliance within a commercial temperature envelope.

Request a quote or submit a product inquiry to receive pricing and availability information for the FM6HZ4G4GXB.