FM6HZ4G4GKA (2R)

The FM6HZ4G4GKA (2R) is a multi-chip package (MCP) that integrates NAND flash and LPDDR4x SDRAM memory in a single surface-mount device. The package combines volatile and non-volatile memory technologies to provide both working memory and storage in a compact form factor.

Targeted at industrial-grade applications, this MCP delivers a 4.295 Gbit memory capacity with a parallel memory interface and an operating temperature range of −40 °C to 85 °C, offering integration and board-space savings for embedded designs requiring combined NAND and DRAM.

Key Features

• Memory Integration (MCP) MCP technology combining NAND flash and LPDDR4x SDRAM in one package for integrated storage and working memory.
• Memory Capacity 4.295 Gbit total memory size with memory organization listed as 256M × 16.
• Volatile and Non-Volatile Includes both volatile (DRAM) and non-volatile (NAND) memory types to support temporary data processing and persistent storage.
• Interface & Performance Parallel memory interface with a clock frequency specification of 2.133 GHz and a write cycle time (word/page) of 15 ns.
• Power Voltage supply specified as 2.5V in the product data.
• Industrial Grade & Temperature Range Grade: Industrial with an operating temperature range of −40 °C to 85 °C for deployment in environments requiring extended temperature tolerance.
• Package & Mounting Surface-mount device in a 9.5 × 8 mm package with 149-ball array, optimized for compact PCB layouts.
• Compliance RoHS compliant.

Typical Applications

• Industrial embedded systems — Combined NAND and DRAM in a single MCP supports designs that need both persistent storage and volatile working memory within an extended temperature range.
• Embedded controllers and modules — Compact 9.5 × 8 mm 149-ball package reduces board space for modules that integrate storage and system memory.
• Edge devices and instrumentation — Industrial-grade temperature tolerance and integrated memory simplify BOM for embedded measurement and control equipment.

Unique Advantages

• Highly integrated solution: NAND flash and LPDDR4x SDRAM in one MCP reduce component count and PCB footprint.
• Combined volatile and non-volatile memory: Simplifies system architecture by co-locating working memory and persistent storage.
• Industrial temperature capability: −40 °C to 85 °C operating range supports deployment in harsh and variable environments.
• Compact, production-ready package: Surface-mount 9.5 × 8 mm, 149-ball package enables dense board-level integration.
• Defined performance parameters: Parallel interface with 2.133 GHz clock frequency and 15 ns write cycle time for predictable timing behavior.
• RoHS compliant: Aligns with environmental regulatory requirements for lead-free assembly.

Why Choose FM6HZ4G4GKA (2R)?

The FM6HZ4G4GKA (2R) MCP positions itself as a compact, industrial-grade memory solution that combines NAND flash and LPDDR4x SDRAM to address designs needing both persistent storage and working memory in a single package. Its specified clock frequency, memory organization, and write cycle timing provide clear, verifiable parameters for integration into embedded systems.

This part is suited for engineering teams and procurement focused on reducing BOM complexity and saving PCB area while maintaining industrial temperature capability and RoHS compliance. The combination of integration, package density, and defined electrical and timing specifications delivers a durable option for long-term industrial deployments.

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