FM6BD4G2GKA (2J)

The FM6BD4G2GKA (2J) from ESMT is a multi-chip package (MCP) that integrates non-volatile NAND flash and volatile LPDDR2 SDRAM into a single surface-mount package. The series combines a 4Gb NAND device and a 2Gb LPDDR2 SDRAM in an MCP architecture (NAND + DRAM), providing both persistent storage and high-speed volatile memory in one component.

Designed to simplify memory subsystem integration, this MCP delivers measurable timing and clock characteristics for designs that require both memory types in a compact commercial-grade package.

Key Features

• Memory Core  Integrated 4Gb NAND Flash (512Mbx8) plus 2Gb LPDDR2 SDRAM (64Mbx32) as indicated in the product designation; supports combined volatile and non-volatile storage in a single MCP.
• Memory Capacity  NAND capacity listed as 4.295 Gbit in specifications and organized as 64M × 32 for the DRAM component.
• Performance & Timing  Clock frequency specified at 533 MHz and a write cycle time (word/page) of 15 ns, providing defined timing characteristics for system integration.
• Interface  Parallel memory interface suitable for designs that utilize parallel memory connections between controller and MCP.
• Power & Mounting  Product name indicates 1.8V operation for the memory components; specifications list a voltage supply value of 2.5V. The device is supplied in a surface-mount package.
• Package & Temperature  Compact 10.5×8 mm, 162-ball package (surface mount) and a commercial operating temperature range of 0°C to 70°C.
• Compliance & Grade  Commercial-grade device with RoHS compliance noted in environmental specifications.

Unique Advantages

• Highly integrated MCP  Combines NAND flash and LPDDR2 SDRAM in one package (MCP), reducing component count and simplifying board-level memory integration.
• Defined timing and clock spec  With a 533 MHz clock frequency and 15 ns write cycle time, the component delivers concrete timing data for system design and validation.
• Compact 162-ball package  The 10.5×8 mm, 162-ball surface-mount package supports high-density board layouts and compact form-factor designs.
• Dual memory types  The combination of volatile and non-volatile memory in one device supports mixed storage architectures without separate discrete parts.
• Commercial operating range  Rated for 0°C to 70°C, suitable for standard commercial electronics environments.
• RoHS compliant  Environmentally compliant construction as specified in the product data.

Why Choose FM6BD4G2GKA (2J)?

The FM6BD4G2GKA (2J) positions itself as an integrated memory solution from ESMT, offering both non-volatile NAND and volatile LPDDR2 SDRAM in a single MCP. Its documented clock frequency, write cycle timing, compact 162-ball package, and clear operating-temperature and compliance information make it a straightforward component choice for designs that require co-located storage and working memory with defined electrical and mechanical characteristics.

This part is suited to projects that prioritize component consolidation and predictable timing parameters within a commercial temperature range, providing a consistent sourcing option backed by ESMT’s MCP series specifications.

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