FM6BD2G2GKA (2Q)

The FM6BD2G2GKA (2Q) is a multi-chip package (MCP) from ESMT that integrates 2Gb NAND Flash and 2Gb LPDDR2 SDRAM into a single surface-mount device. The package combines volatile and non-volatile memory technologies in a compact 10.5×8 mm, 162-ball footprint.

This MCP is targeted at designs that benefit from co-located NAND and DRAM in a single component, offering a compact memory solution with a parallel interface and a documented clock frequency of 533 MHz.

Key Features

• Memory Composition  Combines 2Gb NAND Flash (non-volatile) and 2Gb LPDDR2 SDRAM (volatile) in a single MCP as indicated in the product name and technology fields.
• Capacity & Organization  Total memory size listed as 2.147 Gbit with memory organization specified as 64M × 32 for the DRAM portion and NAND sizing indicated in the part name (256M × 8).
• Performance  Clock frequency specified at 533 MHz and a write cycle time (word page) of 15 ns, providing documented timing characteristics for system design.
• Interface  Parallel memory interface for both NAND and DRAM access as specified in the product data.
• Power  Voltage supply listed as 2.5V; product name indicates 1.8V for the individual memory blocks as shown in the part designation.
• Package & Mounting  Surface-mount package in a 10.5×8 mm, 162-ball footprint suitable for space-constrained PCBs.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• Compliance  RoHS compliant as indicated in the environmental data.

Unique Advantages

• Highly integrated MCP: Single-package combination of NAND and LPDDR2 reduces board-level component count and simplifies routing for designs that require both memory types.
• Dual memory types: Integration of volatile and non-volatile memory in one device supports mixed-storage system architectures without separate memory components.
• Documented timing and clocking: 15 ns write cycle time and 533 MHz clock frequency provide concrete parameters for performance budgeting and timing analysis.
• Compact, surface-mount package: 10.5×8 mm, 162-ball footprint enables high-density layouts and is suitable for space-constrained applications.
• Commercial temperature rating: Operates across 0 °C to 70 °C for a wide range of consumer and industrial use cases requiring commercial-grade components.
• RoHS compliant: Environmental compliance for regulatory alignment with lead-free manufacturing processes.

Why Choose FM6BD2G2GKA (2Q)?

The FM6BD2G2GKA (2Q) MCP from ESMT provides a compact, integrated memory solution that pairs 2Gb NAND Flash with 2Gb LPDDR2 SDRAM, backed by explicit timing and clock frequency specifications. Its parallel interface, combined memory types, and small 10.5×8 mm, 162-ball surface-mount package make it suitable for designs that require co-located volatile and non-volatile storage while minimizing board space.

As a commercial-grade, RoHS-compliant part, FM6BD2G2GKA (2Q) is appropriate for projects with defined temperature and voltage requirements and for teams that need clear, verifiable device parameters for system-level integration and procurement from a known manufacturer, ESMT.

Request a quote to obtain current pricing and lead-time information for FM6BD2G2GKA (2Q) or submit a purchasing inquiry to move forward with evaluation and procurement.