FM6BD2G2GXA(2L)

The FM6BD2G2GXA(2L) from ESMT is a multi-chip package (MCP) that integrates NAND Flash and LPDDR2 SDRAM in a compact surface-mount form factor. It combines non-volatile NAND storage with volatile DRAM to support designs that need both persistent data storage and working memory in a single component.

This MCP is targeted at commercial-grade embedded systems and devices that require a tightly integrated memory solution with defined electrical, timing and mechanical characteristics for straightforward board-level integration.

Key Features

• Integrated MCP (NAND + DRAM)  Combines non-volatile NAND Flash and volatile LPDDR2 SDRAM in a single package to simplify BOM and board layout.
• Memory Capacity  Total memory size reported as 2.147 Gbit, with NAND Flash (256Mbx8) plus LPDDR2 SDRAM (64Mbx32) organization.
• Performance  LPDDR2 clock frequency specified at 533 MHz and a write cycle time (word/page) of 15 ns for predictable memory timing.
• Interface and Organization  Parallel memory interface with the SDRAM organized as 64M x 32 to match common system memory architectures.
• Supply Voltage  Supply voltage specified as 2.5 V for device operation.
• Package and Mounting  Surface-mount 162-ball package in a 10.5 × 8 mm footprint for compact board-level integration.
• Operating Range  Commercial grade with an operating temperature of 0 °C to 70 °C.
• Compliance  RoHS compliant for environmental regulatory alignment.

Typical Applications

• Embedded Systems  Compact MCP integration of NAND and LPDDR2 suits embedded controllers and appliances that require both code storage and runtime memory.
• Consumer Electronics  Surface-mount 10.5 × 8 mm package supports space-constrained consumer designs needing combined persistent and working memory.
• Industrial Controls  Commercial-grade temperature range and integrated memory reduce board area for industrial devices with standard operating environments.

Unique Advantages

• Highly Integrated Solution:  NAND Flash and LPDDR2 combined in one MCP reduces component count and simplifies PCB routing.
• Compact Package:  162-ball, 10.5 × 8 mm footprint enables denser board layouts and smaller system form factors.
• Defined Performance Characteristics:  533 MHz clock frequency and 15 ns write cycle time provide clear timing parameters for system design.
• Mixed Memory Types:  Both volatile and non-volatile memory types are included to support data storage and runtime operations without separate components.
• Regulatory Compliance:  RoHS compliance supports regulatory requirements for electronic assemblies.

Why Choose FM6BD2G2GXA(2L)?

The FM6BD2G2GXA(2L) positions itself as a compact, integrated memory option for commercial embedded and electronic designs that require both NAND Flash and LPDDR2 SDRAM. Its combined memory architecture and surface-mount 162-ball package simplify board design while providing clear electrical and timing specifications for predictable integration.

Designers and procurement teams looking for an MCP that balances storage, working memory, and a small footprint will find this ESMT device appropriate for applications operating within the specified 0 °C to 70 °C commercial range.

Request a quote or submit an inquiry to receive pricing, lead‑time information, and availability for the FM6BD2G2GXA(2L).