FM62D4G2GXB (2V)

The FM62D4G2GXB (2V) is an ESMT multi-chip package (MCP) that integrates 4Gb NAND Flash and 2Gb LPDDR2 SDRAM in a single surface-mount module. The package combines non-volatile and volatile memory technologies to provide compact, board-level memory integration.

The product designation indicates 1.8V operation for the NAND and LPDDR2 components; the supplied specifications list a VoltageSupply of 2.5V. The MCP implements a parallel memory interface with a listed clock frequency of 533 MHz and a memory organization of 128M × 16.

Key Features

• Integrated Memory Composition  4Gb NAND Flash (512Mbx8) combined with 2Gb LPDDR2 SDRAM (128Mbx16) in a single MCP configuration.
• Memory Capacity  Total non-volatile memory noted as 4.295 Gbit and volatile memory organized as 128M × 16.
• Interface and Timing  Parallel memory interface with a clock frequency of 533 MHz and a word/page write cycle time of 15 ns.
• Technology  MCP (NAND + DRAM) technology integrates both volatile and non-volatile memory types in one package.
• Supply and Grade  VoltageSupply listed as 2.5V and commercial grade operation.
• Package and Mounting  Surface-mount 10.5 × 8 mm, 162-ball package for compact board footprint and high-density placement.
• Operating Temperature  Rated for 0 °C to 70 °C commercial operating temperature range.
• Environmental Compliance  RoHS-compliant design.

Unique Advantages

• Highly integrated MCP: NAND and LPDDR2 combined into one 10.5 × 8 mm, 162-ball surface-mount package reduces board-level component count.
• Parallel interface with defined timing: 533 MHz clock frequency and 15 ns word/page write-cycle time provide clear performance parameters for system design.
• Mixed memory types: Presence of both volatile and non-volatile memory in a single module supports designs that require on-package working memory and persistent storage.
• Compact footprint: 10.5 × 8 mm package supports space-constrained designs while maintaining a high-density ball grid.
• Commercial temperature and compliance: Rated 0 °C to 70 °C and RoHS-compliant for standard commercial applications.

Why Choose FM62D4G2GXB (2V)?

The FM62D4G2GXB (2V) positions itself as a space-efficient integrated memory solution from ESMT, combining 4Gb NAND Flash and 2Gb LPDDR2 SDRAM in a single MCP package. Its defined parallel interface, 533 MHz clock frequency, and compact 10.5 × 8 mm, 162-ball package make it suitable for designs that require on-board integration of both persistent and working memory within a commercial temperature profile.

Engineers specifying the FM62D4G2GXB (2V) benefit from a clear set of electrical and mechanical characteristics—memory organization, timing, package, and operating range—that simplify component selection and PCB layout for compact, mixed-memory implementations.

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