FM62D2G2GKA (2Q)

The FM62D2G2GKA (2Q) from ESMT is a multi-chip package (MCP) that integrates NAND Flash and LPDDR2 SDRAM into a single surface-mount device. It pairs a 2Gb NAND Flash (256Mbx8) with a 2Gb LPDDR2 SDRAM (128Mbx16) in an MCP architecture to provide both non-volatile and volatile memory on a compact footprint.

Designed for commercial-grade applications, this MCP combines parallel memory interfaces, a 533 MHz clock capability, and a 10.5 × 8 mm, 162-ball package to deliver a space-efficient memory solution where integrated volatile and non-volatile storage is required.

Key Features

• Integrated MCP Technology Combines NAND Flash and LPDDR2 SDRAM in a single MCP package for consolidated memory functions.
• Dual Memory Composition Contains 1.8V 2Gb NAND Flash (256Mbx8) plus 1.8V 2Gb LPDDR2 SDRAM (128Mbx16), providing both non-volatile and volatile memory types.
• Memory Size and Organization Memory size listed as 2.147 Gbit with organization specified as 128M × 16 for the DRAM portion.
• Performance Clock frequency specified at 533 MHz and a write cycle time (word/page) of 15 ns.
• Interface and Mounting Parallel memory interface with surface-mount package for board-level integration.
• Power Voltage supply specified at 2.5V.
• Package Compact 10.5 × 8 mm, 162-ball package (surface mount) suitable for space-constrained designs.
• Operating Range Commercial operating temperature range of 0°C to 70°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Integrated Memory Modules Designs that require both non-volatile NAND and volatile LPDDR2 memory in a single package to simplify board layout.
• Space-Constrained Embedded Designs Compact 10.5 × 8 mm, 162-ball MCP is suitable where PCB real estate is limited.
• Commercial Electronics Commercial-grade systems operating within 0°C to 70°C that need parallel memory interfaces and consolidated storage.

Unique Advantages

• Highly integrated solution: Integration of NAND Flash and LPDDR2 in one MCP reduces component count and simplifies assembly.
• Compact package: 10.5 × 8 mm, 162-ball surface-mount package minimizes board area for dense designs.
• Clear performance parameters: 533 MHz clock frequency and 15 ns write cycle time provide verifiable performance metrics for system planning.
• Versatile memory mix: Combined volatile and non-volatile memory supports systems that need both runtime data and persistent storage.
• Commercial temperature grade: Specified 0°C to 70°C operation aligns with standard commercial electronics requirements.
• Regulatory compliance: RoHS compliance supports environmentally regulated manufacturing processes.

Why Choose FM62D2G2GKA (2Q)?

The FM62D2G2GKA (2Q) positions itself as a compact, integrated memory option for designs that require both NAND Flash and LPDDR2 SDRAM. With explicit specifications for clock frequency, write cycle timing, package dimensions, and operating temperature, it provides clear, engineer-friendly data points for system integration and validation.

This MCP is suited to engineers and procurement teams looking for a commercial-grade, space-efficient memory package combining volatile and non-volatile storage with parallel interface support and RoHS compliance.

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