FM62D2G2GXA (2L)

The FM62D2G2GXA (2L) from ESMT is a multi-chip package (MCP) that integrates NAND Flash and LPDDR2 SDRAM technologies in a single surface-mount module. The part name specifies 2Gb NAND Flash (256Mbx8) paired with 2Gb LPDDR2 SDRAM (128Mbx16), providing both non-volatile and volatile memory in one compact package.

Designed for commercial-grade electronics, this MCP combines parallel memory interfaces, a 533 MHz clock frequency, and a small 10.5×8 mm, 162-ball package to address space-constrained board designs that require both storage and working memory.

Key Features

• Memory Composition  Combines 2Gb NAND Flash (256Mbx8) and 2Gb LPDDR2 SDRAM (128Mbx16) as indicated by the part name, supporting both volatile and non-volatile storage in one module.
• Memory Capacity  Memory size reported as 2.147 Gbit with a memory organization of 128M × 16.
• Clock & Timing  533 MHz clock frequency and a write cycle time (word/page) of 15 ns for responsive data operations.
• Interface  Parallel memory interface suitable for designs that use parallel DRAM and NAND connections.
• Power  Voltage supply listed at 2.5 V; the part name references 1.8V devices as part of its designation.
• Format & Technology  MCP technology combining NAND and DRAM in a single package to reduce board-level component count.
• Package & Mounting  10.5×8 mm, 162-ball package in a surface-mount form factor to support compact PCB layouts.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded systems  Use where a compact MCP combining NAND Flash and LPDDR2 DRAM simplifies board design and reduces BOM.
• Consumer electronics  Suitable for commercial-grade devices requiring both on-board storage and working memory within a 0 °C to 70 °C range.
• Space-constrained designs  10.5×8 mm, 162-ball surface-mount package helps minimize PCB area for compact products.

Unique Advantages

• Highly integrated solution:  Combines NAND Flash and LPDDR2 SDRAM in one MCP to reduce component count and simplify layout.
• Dual memory types:  Supports both volatile and non-volatile storage options within the same package for flexible system architectures.
• Compact package:  10.5×8 mm, 162-ball surface-mount package enables dense PCB integration in small form-factor devices.
• Performance-oriented timing:  533 MHz clock frequency and 15 ns word/page write cycle time for responsive memory operations.
• Commercial temperature grade:  Specified 0 °C to 70 °C operating range suitable for a wide range of consumer and embedded applications.
• RoHS compliant:  Meets RoHS environmental requirements for regulated markets.

Why Choose FM62D2G2GXA (2L)?

The FM62D2G2GXA (2L) positions itself as a space-saving, dual-function memory module that brings NAND Flash and LPDDR2 SDRAM together in a single 10.5×8 mm MCP package. Its parallel interface, 533 MHz clocking, and 15 ns write cycle timing make it suitable for designs that need both on-board storage and working memory while keeping PCB area and BOM complexity low.

This part is a practical choice for engineers designing commercial-grade embedded and consumer products that operate within 0 °C to 70 °C and require RoHS-compliant components. Its integrated approach supports streamlined designs and can simplify sourcing and assembly for high-volume production.

Request a quote or submit an inquiry to receive pricing and availability for FM62D2G2GXA (2L) and to discuss quantity, lead time, and delivery options.