FM6BD1G12MB(2W)

The FM6BD1G12MB(2W) is a multichip package (MCP) integrating NAND Flash and LPDDR2 SDRAM in a single surface-mount device. The package combines a 1Gb NAND Flash (128Mbx8) with a 512Mb LPDDR2 SDRAM (32Mbx16), providing both non-volatile and volatile memory in a compact footprint for industrial designs.

Key technical attributes include a memory size of 1.074 Gbit, a clock frequency rating of 533 MHz, a parallel memory interface, and an industrial operating temperature range of -40 °C to 85 °C. The device is supplied in a 10.5 × 8 mm, 162-ball package and is RoHS compliant.

Key Features

• Integrated MCP (NAND + DRAM) Combines non-volatile NAND Flash and volatile LPDDR2 SDRAM in a single package to simplify board-level integration and reduce component count.
• Memory Capacity Total memory listed as 1.074 Gbit with NAND Flash and LPDDR2 organizations indicated by the product name (1Gb NAND: 128Mbx8; 512Mb LPDDR2: 32Mbx16).
• Clock Performance Clock frequency rated at 533 MHz to support the memory timing requirements of the integrated LPDDR2 SDRAM.
• Access Timing Write cycle time (word/page) specified at 15 ns for quick program/write operations where applicable.
• Interface and Organization Parallel memory interface with a 32M × 16 organization for the LPDDR2 component as specified in the product data.
• Power Supply Voltage supply listed as 2.5V in the product specifications; the product name denotes 1.8V components for NAND and LPDDR2 as part of the MCP designation.
• Industrial Grade & Temperature Range Rated for industrial operation from -40 °C to 85 °C to meet the thermal requirements of industrial applications.
• Package and Mounting Surface-mount 10.5 × 8 mm, 162-ball package designed for compact board-level integration.
• Regulatory Compliance RoHS compliant as stated in the product data.

Unique Advantages

• Highly integrated solution: MCP architecture (NAND + DRAM) consolidates volatile and non-volatile memory into one package, reducing BOM and board area.
• Industrial temperature rating: Specified -40 °C to 85 °C supports deployment in industrial environments with wide thermal requirements.
• Compact footprint: 10.5 × 8 mm, 162-ball package minimizes PCB real estate while preserving required memory capacity.
• High-frequency operation: 533 MHz clock frequency supports the LPDDR2 timing profile documented in the product specifications.
• Clear memory organization: 32M × 16 organization and defined memory sizing (1.074 Gbit) make integration planning and memory mapping straightforward.
• RoHS compliance: Environmentally compliant manufacturing and materials per product data.

Why Choose FM6BD1G12MB(2W)?

FM6BD1G12MB(2W) is positioned for industrial designs that require both non-volatile storage and high-speed volatile memory in a single, compact package. Its MCP architecture, combined memory sizing, and a 10.5 × 8 mm, 162-ball surface-mount package simplify integration for space-constrained boards.

With an industrial operating range of -40 °C to 85 °C, a 533 MHz clock frequency rating, and RoHS compliance, this MCP is well suited for system designs demanding integrated memory functionality and predictable, specification-backed electrical and thermal characteristics.

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