FM6BD2G2GXA2L

The FM6BD2G2GXA (2L) is a multi-chip package (MCP) from ESMT combining 2Gb NAND Flash (256Mbx8) and 2Gb LPDDR2 SDRAM (64Mbx32) in a single surface-mount package. The device provides both non-volatile NAND and volatile DRAM in a compact MCP architecture designed for industrial-grade applications.

This MCP is specified with a parallel memory interface and includes system-level parameters such as a 533 MHz clock frequency, a 15 ns write cycle time for word/page operations, and an operating temperature range of -40°C to 85°C.

Key Features

• Integrated MCP (NAND + DRAM)  The package combines non-volatile NAND Flash and volatile LPDDR2 SDRAM to simplify BOM and board-level integration.
• Memory Capacity & Organization  2.147 Gbit total memory with organization of 64M × 32 for the DRAM and 256M × 8 for the NAND Flash.
• Clock & Timing  533 MHz clock frequency and a 15 ns write cycle time for word/page operations, as specified for the device.
• Interface  Parallel memory interface to match parallel-memory designs and legacy interfaces that require parallel access.
• Power  Product name indicates 1.8V NAND and 1.8V LPDDR2; device specification lists a voltage supply value of 2.5V.
• Industrial Grade & Temperature Range  Classified as Industrial with an operating range from -40°C to 85°C for deployments in temperature-challenging environments.
• Package & Mounting  Surface-mount package in a 10.5 × 8 mm, 162-ball footprint for compact board-level integration.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Embedded Systems  Integration of NAND and LPDDR2 in a single MCP supports compact memory subsystems in industrial controllers and embedded modules operating across -40°C to 85°C.
• Storage-Enabled Modules  Combined non-volatile and volatile memory is suitable for modules that require local storage plus working memory in a single package.
• Edge and IoT Gateways  The MCP form factor and industrial temperature rating support edge devices requiring both persistent data storage and DRAM for runtime tasks.

Unique Advantages

• Highly integrated solution: Combines NAND Flash and LPDDR2 SDRAM in one MCP to reduce board space and simplify assembly.
• Industrial temperature capability: Rated for -40°C to 85°C, enabling deployment in temperature-sensitive environments.
• Compact, assembly-ready package: 10.5 × 8 mm, 162-ball surface-mount package minimizes PCB footprint while supporting standard SMD assembly.
• Clear timing specification: 15 ns write cycle time and 533 MHz clock frequency provide defined timing characteristics for system design.
• Dual memory types: Co-located volatile and non-volatile memory simplifies system architecture for designs that need both working memory and persistent storage.
• RoHS compliant: Environmentally compliant material selection for regulatory alignment.

Why Choose FM6BD2G2GXA (2L)?

The FM6BD2G2GXA (2L) positions itself as a compact, industrial-grade MCP that brings NAND Flash and LPDDR2 SDRAM together to simplify memory subsystem design. With explicit timing and clock specifications, a defined memory organization, and a small 10.5 × 8 mm package, it targets engineers looking to reduce BOM complexity while meeting temperature and footprint constraints.

This part is suited to designers of industrial embedded systems, storage-enabled modules, and edge devices that require both persistent and volatile memory within a single surface-mount package. Backed by ESMT and identified within the NAND Base MCP series, the FM6BD2G2GXA (2L) offers a clear specification set for integration and procurement in industrial applications.

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