FM6BD1G1GMB (2G)
| Part Description |
1.8V 1Gb NAND Flash (128Mbx8) + 1.8V 1Gb LPDDR2 SDRAM (32Mbx32) |
|---|---|
| Quantity | 1,060 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 10.5x8 (mm),162 ball | Memory Format | MCP | Technology | MCP (NAND + DRAM) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 533 MHz | Voltage | 2.5V | Memory Type | Volatile, Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 15 ns | Packaging | 10.5x8 (mm),162 ball | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 32M x 32 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of FM6BD1G1GMB (2G) – 1.8V 1Gb NAND Flash (128Mbx8) + 1.8V 1Gb LPDDR2 SDRAM (32Mbx32)
The FM6BD1G1GMB (2G) is a multi-chip package (MCP) that integrates 1.8V 1Gb NAND Flash (128Mbx8) and 1.8V 1Gb LPDDR2 SDRAM (32Mbx32) in a single component. The device combines volatile and non-volatile memory technologies with a parallel memory interface for compact system integration.
This MCP provides a consolidated memory footprint in a 10.5×8 mm, 162-ball surface-mount package and is specified with a memory size of 1.074 Gbit, a 533 MHz clock frequency and a 0 °C to 70 °C operating range.
Key Features
- Memory Architecture (NAND + DRAM) MCP format combining NAND Flash and LPDDR2 SDRAM to provide both non-volatile and volatile memory in one package.
- Performance 533 MHz clock frequency and a write cycle time (word/page) of 15 ns as specified.
- Capacity & Organization Memory size listed as 1.074 Gbit with a memory organization of 32M × 32.
- Interface Parallel memory interface for standard MCP integration.
- Power Voltage supply specified as 2.5V.
- Package & Mounting 10.5 × 8 mm, 162-ball package in a surface-mount format (supplier device package: 10.5 × 8 mm, 162 ball).
- Operating Conditions & Grade Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Compliance RoHS compliant.
Unique Advantages
- Highly integrated MCP: Combines NAND Flash and LPDDR2 in one package to simplify board-level memory integration.
- Compact package footprint: 10.5×8 mm, 162-ball surface-mount package reduces board area for space-constrained designs.
- Dual memory types: Both volatile and non-volatile storage are available in a single component, offering design flexibility.
- Measured performance parameters: 533 MHz clock frequency and 15 ns write cycle time provide explicit performance targets for system design.
- Commercial operating range: Rated for 0 °C to 70 °C operation to match commercial-grade system requirements.
- RoHS compliant: Conforms to lead-free manufacturing and regulatory requirements.
Why Choose FM6BD1G1GMB (2G)?
FM6BD1G1GMB (2G) positions itself as a compact, integrated memory solution that pairs NAND Flash and LPDDR2 SDRAM in a single MCP from ESMT. Its specified clock frequency, write-cycle timing, and package details provide clear, verifiable parameters for system designers targeting consolidated memory implementations.
This component is suited to designs that require combined volatile and non-volatile memory in a small surface-mount package while maintaining commercial-grade operating conditions and RoHS compliance. Selecting this MCP supports a simplified board-level memory approach and predictable hardware characteristics backed by ESMT manufacturing.
Request a quote or contact sales to inquire about pricing, availability, and ordering for FM6BD1G1GMB (2G).
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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