FM6BD4G4GKMA (2J)
| Part Description |
1.8V 4Gb NAND Flash (512Mbx8) + 1.8V 4Gb LPDDR2 SDRAM (128Mbx32) |
|---|---|
| Quantity | 1,520 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 10.5x8 (mm),162 ball | Memory Format | MCP | Technology | MCP (NAND + DRAM) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 533 MHz | Voltage | 2.5V | Memory Type | Volatile, Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 15 ns | Packaging | 10.5x8 (mm),162 ball | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 128M x 32 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of FM6BD4G4GKMA (2J) – 1.8V 4Gb NAND Flash (512Mbx8) + 1.8V 4Gb LPDDR2 SDRAM (128Mbx32)
The FM6BD4G4GKMA (2J) from ESMT is a multi-chip package (MCP) that integrates non-volatile NAND flash and volatile LPDDR2 SDRAM in a single surface-mount module. It combines NAND and DRAM technology with a parallel memory interface and is supplied in a compact 10.5 × 8 mm, 162-ball package intended for commercial-grade designs.
Key attributes include a 533 MHz clock frequency, a total memory size specification of 4.295 Gbit, a 128M × 32 memory organization, and a 2.5 V supply. The device is RoHS compliant and rated for an operating temperature range of 0 °C to 70 °C.
Key Features
- Memory Architecture MCP combining NAND flash (non-volatile) and LPDDR2 SDRAM (volatile) in a single package.
- Memory Capacity & Organization Total memory size listed as 4.295 Gbit with a memory organization of 128M × 32.
- Performance 533 MHz clock frequency and a write cycle time (word/page) of 15 ns for responsive memory transactions.
- Interface Parallel memory interface for straightforward integration with parallel-supporting host designs.
- Power Specified supply voltage of 2.5 V for consistent power planning.
- Package & Mounting Surface-mount 10.5 × 8 mm package with 162 balls to support compact PCB layouts.
- Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Environmental Compliance RoHS compliant to meet regulatory material requirements.
Unique Advantages
- Highly integrated MCP: Combines NAND and LPDDR2 DRAM in one package, simplifying board-level design and reducing component count.
- Compact footprint: 10.5 × 8 mm, 162-ball package enables high-density layouts where board space is limited.
- Defined performance parameters: 533 MHz clock and 15 ns write cycle time provide clear timing targets for system designers.
- Straightforward system integration: Parallel memory interface and 128M × 32 organization simplify mapping to parallel host interfaces.
- Commercial suitability with compliance: RoHS compliant and specified for 0 °C to 70 °C operation for commercial deployments.
Why Choose FM6BD4G4GKMA (2J)?
FM6BD4G4GKMA (2J) is positioned as a compact, integrated memory solution from ESMT that brings non-volatile NAND and volatile LPDDR2 SDRAM together in a single MCP. Its defined clock frequency, memory organization, and write timing make it suitable for designs that require both memory types in a small surface-mount package.
With commercial-grade operating range, RoHS compliance, and a 10.5 × 8 mm, 162-ball package, this MCP offers a practical balance of integration, packaging density, and predictable electrical characteristics for procurement and engineering teams evaluating integrated memory options.
Request a quote or contact sales to discuss availability, pricing and how FM6BD4G4GKMA (2J) can fit into your next design.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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