FM6BD4G4GKMA (2J)

4Gb NAND+LPDDR2 MCP
Part Description

1.8V 4Gb NAND Flash (512Mbx8) + 1.8V 4Gb LPDDR2 SDRAM (128Mbx32)

Quantity 1,520 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package10.5x8 (mm),162 ballMemory FormatMCPTechnologyMCP (NAND + DRAM)
Memory Size4 GbitAccess TimeN/AGradeCommercial
Clock Frequency533 MHzVoltage2.5VMemory TypeVolatile, Non-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page15 nsPackaging10.5x8 (mm),162 ball
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization128M x 32
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of FM6BD4G4GKMA (2J) – 1.8V 4Gb NAND Flash (512Mbx8) + 1.8V 4Gb LPDDR2 SDRAM (128Mbx32)

The FM6BD4G4GKMA (2J) from ESMT is a multi-chip package (MCP) that integrates non-volatile NAND flash and volatile LPDDR2 SDRAM in a single surface-mount module. It combines NAND and DRAM technology with a parallel memory interface and is supplied in a compact 10.5 × 8 mm, 162-ball package intended for commercial-grade designs.

Key attributes include a 533 MHz clock frequency, a total memory size specification of 4.295 Gbit, a 128M × 32 memory organization, and a 2.5 V supply. The device is RoHS compliant and rated for an operating temperature range of 0 °C to 70 °C.

Key Features

  • Memory Architecture  MCP combining NAND flash (non-volatile) and LPDDR2 SDRAM (volatile) in a single package.
  • Memory Capacity & Organization  Total memory size listed as 4.295 Gbit with a memory organization of 128M × 32.
  • Performance  533 MHz clock frequency and a write cycle time (word/page) of 15 ns for responsive memory transactions.
  • Interface  Parallel memory interface for straightforward integration with parallel-supporting host designs.
  • Power  Specified supply voltage of 2.5 V for consistent power planning.
  • Package & Mounting  Surface-mount 10.5 × 8 mm package with 162 balls to support compact PCB layouts.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Environmental Compliance  RoHS compliant to meet regulatory material requirements.

Unique Advantages

  • Highly integrated MCP: Combines NAND and LPDDR2 DRAM in one package, simplifying board-level design and reducing component count.
  • Compact footprint: 10.5 × 8 mm, 162-ball package enables high-density layouts where board space is limited.
  • Defined performance parameters: 533 MHz clock and 15 ns write cycle time provide clear timing targets for system designers.
  • Straightforward system integration: Parallel memory interface and 128M × 32 organization simplify mapping to parallel host interfaces.
  • Commercial suitability with compliance: RoHS compliant and specified for 0 °C to 70 °C operation for commercial deployments.

Why Choose FM6BD4G4GKMA (2J)?

FM6BD4G4GKMA (2J) is positioned as a compact, integrated memory solution from ESMT that brings non-volatile NAND and volatile LPDDR2 SDRAM together in a single MCP. Its defined clock frequency, memory organization, and write timing make it suitable for designs that require both memory types in a small surface-mount package.

With commercial-grade operating range, RoHS compliance, and a 10.5 × 8 mm, 162-ball package, this MCP offers a practical balance of integration, packaging density, and predictable electrical characteristics for procurement and engineering teams evaluating integrated memory options.

Request a quote or contact sales to discuss availability, pricing and how FM6BD4G4GKMA (2J) can fit into your next design.

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