FM62D2G1GXA (2U)

The FM62D2G1GXA (2U) from ESMT is a Multi-Chip Package (MCP) that combines non-volatile NAND Flash and volatile LPDDR2 SDRAM in a single surface-mount package. The module integrates a 2.147 Gbit NAND Flash element alongside a 1Gb LPDDR2 SDRAM organized as 64M x 16, providing parallel memory interfaces for compact system designs.

Designed for commercial-temperature applications, this MCP delivers a compact footprint and a clocked memory interface at 533 MHz, targeting designs that require tightly integrated NAND and DRAM with a clear specification set for power, timing and mounting.

Key Features

• Integrated MCP (NAND + DRAM) – Combines non-volatile NAND Flash and volatile LPDDR2 SDRAM in one package to simplify board-level memory integration.
• Memory capacity & organization – 2.147 Gbit NAND Flash combined with 1Gb LPDDR2, organized as 64M × 16 for the DRAM component.
• Clocked interface – Specified clock frequency of 533 MHz to support high-speed parallel memory access patterns.
• Timing – Write cycle time (word/page) specified at 15 ns for deterministic write timing characteristics.
• Power – Voltage supply specified as 2.5V in the product specifications.
• Package & mounting – Surface-mount MCP in a 10.5 × 8 mm, 162-ball package for compact PCB layouts.
• Operating grade – Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Environmental compliance – RoHS compliant as specified in the product data.

Typical Applications

• Integrated memory subsystems – Systems that require both NAND Flash and LPDDR2 SDRAM in a single package to reduce board area and simplify routing.
• Space-constrained designs – Compact electronics and modules that benefit from the 10.5 × 8 mm, 162-ball MCP package and surface-mount mounting type.
• Commercial temperature deployments – Applications operating within 0 °C to 70 °C that need a combined volatile and non-volatile memory solution.
• High-frequency memory interfaces – Designs leveraging a 533 MHz clock frequency for parallel memory access.

Unique Advantages

• Highly integrated solution: NAND Flash and LPDDR2 SDRAM in a single MCP simplifies BOM and PCB layout.
• Compact package: 10.5 × 8 mm, 162-ball package minimizes board footprint for dense designs.
• Clear electrical and timing specs: 2.5V supply and 15 ns write cycle time provide concrete parameters for system design.
• Defined performance envelope: 533 MHz clock frequency supports designers targeting higher-speed parallel memory operations.
• Commercial-grade reliability: Specified operating temperature range of 0 °C to 70 °C supports standard commercial applications.
• Regulatory alignment: RoHS compliance supports lead-free assembly processes.

Why Choose FM62D2G1GXA (2U)?

The FM62D2G1GXA (2U) from ESMT is positioned for designs that require a tightly integrated dual-memory solution with explicit electrical, timing and packaging specifications. Its combination of 2.147 Gbit NAND Flash and 1Gb LPDDR2 SDRAM, delivered in a compact 10.5 × 8 mm MCP, helps reduce board complexity while providing a defined performance profile with a 533 MHz clock and 15 ns write cycle time.

Choose this MCP when your design priorities include integration, a reduced PCB footprint, and clear commercial-temperature operation backed by a RoHS-compliant component from ESMT.

Request a quote or contact sales to check availability and pricing for FM62D2G1GXA (2U) and to discuss lead times and ordering options.