FM62D1G1GMB (2G)

The FM62D1G1GMB (2G) from ESMT is a multi-chip package (MCP) that integrates NAND Flash and LPDDR2 SDRAM memory technologies in a single surface-mount device. The assembly combines volatile and non-volatile memory to provide both temporary working memory and persistent storage in a compact form factor.

This MCP architecture is intended for designs that require co-located NAND Flash and DRAM resources, offering a streamlined memory footprint and consolidated integration while exposing parallel memory interfaces and measurable performance characteristics.

Key Features

• Integrated MCP (NAND + DRAM) Combines NAND Flash and LPDDR2 SDRAM in a single multi-chip package to provide both volatile and non-volatile memory on one component.
• Memory Configuration 1Gb NAND Flash (128Mbx8) paired with 1Gb LPDDR2 SDRAM (64Mbx16); overall memory size listed as 1.074 Gbit and organization given as 64M × 16.
• Performance Characteristics Clock frequency specified at 533 MHz and a write cycle time (word/page) of 15 ns, providing concrete timing metrics for system integration.
• Memory Interface Parallel memory interface for integration into systems that accept parallel DRAM/Flash connections.
• Power Voltage supply specified as 2.5V.
• Package and Mounting Compact 10.5 × 8 mm, 162-ball package intended for surface-mount assembly.
• Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• Compliance RoHS compliant.

Typical Applications

• Systems requiring both volatile and non-volatile memory — Use where co-located DRAM and NAND Flash are needed to support working memory and persistent storage within a single MCP.
• Space-constrained board designs — The 10.5 × 8 mm, 162-ball surface-mount package reduces PCB footprint by combining two memory types in one device.
• Commercial electronic products — The commercial grade temperature range (0 °C to 70 °C) and RoHS compliance align with general-purpose consumer and industrial applications.

Unique Advantages

• Highly integrated memory solution: NAND Flash and LPDDR2 are packaged together as an MCP to reduce component count and simplify board-level routing.
• Defined performance metrics: 533 MHz clock frequency and 15 ns write cycle time provide measurable parameters for timing and performance planning.
• Compact SMD package: 10.5 × 8 mm, 162-ball package enables dense PCB layouts and automated surface-mount assembly.
• Dual memory types in one device: Supports both volatile and non-volatile storage needs without adding separate chips for DRAM and Flash.
• Commercial readiness and compliance: Commercial grade operating range and RoHS compliance support standard production and regulatory requirements.

Why Choose FM62D1G1GMB (2G)?

FM62D1G1GMB (2G) positions itself as a compact, integrated memory option where designers need both LPDDR2 SDRAM and NAND Flash in a single surface-mount package. Its MCP architecture, defined timing characteristics (533 MHz clock, 15 ns write cycle), and 10.5 × 8 mm 162-ball footprint make it suitable for designs that prioritize board space consolidation and clear electrical specifications.

Produced by ESMT and provided as a commercial-grade, RoHS-compliant component, this MCP is appropriate for product lines that require co-located volatile and non-volatile memory with defined operating-temperature and packaging constraints.

Request a quote or submit an inquiry for FM62D1G1GMB (2G) to receive pricing and availability information tailored to your project requirements.