Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD641180XF6HD641180XF6RenesasMCU, 8-BIT, 6MHZMicrocontrollersN/AN/AN/A

N/A

574
N/AHD641180XF6VRenesasMCU, 8-BIT, 6MHZMicrocontrollersN/AN/AN/A

N/A

164
HD641180XF8LHD641180XF8LRenesasMCU, 8-BIT, 8MHZMicrocontrollersN/AN/AN/A

N/A

376
HD6413002FP16HD6413002FP16RenesasMCU, 16-BIT, 16MHZMicrocontrollersN/AN/AN/A
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
165
HD6413002VF8HD6413002VF8RenesasMICROCONTROLLER, 16 BIT, H8 CPU,MicrocontrollersN/AN/AN/A
Core Processor:
H8/300H
Core Size:
16-Bit
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
311
HD6413238CP10VHD6413238CP10VRenesasMCU, 8-BITMicrocontrollersN/AN/AN/A

N/A

360
HD6413238F10HD6413238F10RenesasIC MCU 8BIT ROMLESS 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
SCI, UART/USART
Number of I/O:
53
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
797
N/AHD6413238P10VRenesasMCU, 8-BITMicrocontrollersN/AN/AN/A
Core Processor:
H8/300
Core Size:
8-Bit
Connectivity:
SCI, UART/USART
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
353
N/AHD6413258P10RenesasMICROCONTROLLER, 8-BITMicrocontrollersN/AN/AN/A
Core Processor:
H8/300
Core Size:
8-Bit
Connectivity:
SCI, UART/USART
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
444
HD6413388F10VHD6413388F10VRenesasMCU, 16-BITMicrocontrollersN/AN/AN/A

N/A

368
HD6417014F28HD6417014F28RenesasRISC MCU, 32-BIT, 28.7MHZMicrocontrollersN/AN/AN/A

N/A

53
HD6417014F28VHD6417014F28VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
3K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
404
HD6417014RF28VHD6417014RF28VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
3K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
247
HD6417020SVX12IHD6417020SVX12IRenesasIC MCU 32BIT ROMLESS 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
12.5MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,583
HD6417020SVX12IVHD6417020SVX12IVRenesasIC MCU 32BIT ROMLESS 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
12.5MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
481
HD6417020SX20IVHD6417020SX20IVRenesasIC MCU 32BIT ROMLESS 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
350
HD6417032VF12VHD6417032VF12VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
12.5MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
733
HD6417034AF20VHD6417034AF20VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
1,976
HD6417034AFI20VHD6417034AFI20VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-1
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
611
HD6417034BVX20VHD6417034BVX20VRenesasMICROCONTROLLER, 32-BIT, SH7000MicrocontrollersN/AN/AN/A

N/A

156

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