 | | HD6417705BP100BV | Renesas | IC MCU 32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (12x12) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (12×12) | 1,470 | |
 | | HD6417705BP100V | Renesas | IC MCU 32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (12x12) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (12×12) | 638 | |
 | | HD6417705F133BV | Renesas | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 468 | |
 | | HD6417706BP133V | Renesas | RISC MCU, 133.34MHZ | Microcontrollers | N/A | N/A | N/A | N/A | 921 | |
 | | HD6417707RF60A | Renesas | IC MCU 32-BIT FLASH | Microcontrollers | - | N/A | – | Program Memory Type: FLASH Mounting Type: Surface Mount | 1,909 | |
 | | HD6417708RF100AV | Renesas | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SmartCard Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3.15V ~ 3.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 499 | |
 | | HD6417708SF60 | Renesas | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SmartCard Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 38 | |
 | N/A | HD6417710XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 595 | |
 | | HD6417712BPV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 472 | |
 | N/A | HD6417712XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 155 | |
| N/A | | HD6417713BPV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 1,378 | |
 | N/A | HD6417713XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 941 | |
 | | HD6417720BP133CV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, I2C, IrDA, Memory Card, SCI, SD, SIO, SIM, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 1,793 | |
 | | HD6417727BP100CV | Renesas | IC MCU 32BIT ROMLESS 240LFBGA | Microcontrollers | 240-LFBGA (13x13) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-LFBGA (13×13) | 567 | |
 | | HD6417727BP160CV | Renesas | IC MCU 32BIT ROMLESS 240LFBGA | Microcontrollers | 240-LFBGA (13x13) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-LFBGA (13×13) | 606 | |
 | | HD6417727X100CV | Renesas | IC MCU 32BIT ROMLESS 240HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 572 | |
 | | HD6417727X160CV | Renesas | IC MCU 32BIT ROMLESS 240HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 328 | |
 | | HD6417750BP200M | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 221 | |
 | | HD6417750BP200MV | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 781 | |
 | | HD6417750F167 | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 1,753 | |