Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
FW427IPMR-ACTAFW427IPMR-ACTATexas InstrumentsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
8MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,443
FW80321M400SL6R2N/AFW80321M400SL6R2IntelIC MPU XSCALE 400MHZ 544BGAMicroprocessors544-BGA (35x35)N/A0°C ~ 105°C (TC)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TC)
Mounting Type:
Surface Mount
Package / Case:
544-BGA
Supplier Device Package:
544-BGA (35×35)
Grade:
Commercial
1,360
FW80960VH100N/AFW80960VH100IntelIC MPU I960 100MHZ 324BGAMicroprocessors324-BGAN/A0°C ~ 95°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TC)
Mounting Type:
Surface Mount
Package / Case:
324-BGA
Supplier Device Package:
324-BGA
Grade:
Commercial
203
N/AFW82801AAIntelMULTIFUNCTION PERIPHERAL PBGA241Controllers241-BGA (23x23)3V ~ 3.6V, 4.75V ~ 5.25V0°C ~ 100°C (TC)
Protocol:
PCI
Function:
Hub Controller
Interface:
PCI, SMBus
Standards:
USB 1.1
Voltage – Supply:
3V ~ 3.6V, 4.75V ~ 5.25V
Current – Supply:
300mA
Operating Temperature:
0°C ~ 100°C (TC)
Package / Case:
241-BBGA
Supplier Device Package:
241-BGA (23×23)
1,803
N/AFW82801CAMIntelMICRO PERIPHERAL IC PBGA421Controllers421-PBGA (31x31)-–
Protocol:
USB
Function:
Controller
Interface:
PCI
Standards:
USB 1.0
Package / Case:
421-BBGA
Supplier Device Package:
421-PBGA (31×31)
1,305
N/AFW82801ERIntelMULTIFUNCTION PERIPHERAL, CMOSControllers421-PBGA (31x31)-–
Protocol:
USB
Function:
Controller
Interface:
PCI
Standards:
USB 2.0
Package / Case:
421-BBGA
Supplier Device Package:
421-PBGA (31×31)
1,166
FWIXP420BBFWIXP420BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
408
FWIXP420BCFWIXP420BCIntelIC MPU 400MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
307
FWIXP420BDFWIXP420BDIntelIC MPU 533MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
257
FWIXP421BBFWIXP421BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
858
N/AFWIXP422ABBIntelIC MPU INTEL 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Commercial
1,135
FWIXP422BBFWIXP422BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
422
N/AFWIXP425ABBIntelIC MPU IXP425 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Commercial
1,098
N/AFWIXP425ABCIntelIC MPU IXP425 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Commercial
131
FWIXP425BBFWIXP425BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
1,298
FX053013N/AFX053013Texas InstrumentsIC MPU C6-INTEG 300MHZ 298NFBGAMicroprocessors298-NFBGA (13x13)N/A0°C ~ 90°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
298-LFBGA
Supplier Device Package:
298-NFBGA (13×13)
Grade:
Commercial
60
FX164CM4F20FAAXTN/AFX164CM4F20FAAXTInfineon TechnologiesIC MCU 16BIT 32KB FLASH 64TQFPMicrocontrollersPG-TQFP-64-8N/A-40°C ~ 85°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 14×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-64-8
Package / Case:
64-LQFP
943
FX164CM4F40FAAXTN/AFX164CM4F40FAAXTInfineon TechnologiesIC MCU 16BIT 32KB FLASH 64TQFPMicrocontrollersPG-TQFP-64-8N/A-40°C ~ 85°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 14×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-64-8
Package / Case:
64-LQFP
272
FX167CI32F40FBBANTFX167CI32F40FBBANTInfineon TechnologiesIC MCU 16BIT 256KB FLASH 144TQFPMicrocontrollersPG-TQFP-144-7N/A-40°C ~ 85°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
103
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-144-7
Package / Case:
144-LQFP
743
N/AFX32K116LAT0MFMRNXP SemiconductorsS32K116 ARM CORTEX-M0+, 48 MHZ,MicrocontrollersN/AN/AN/A

N/A

1,418

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