 | | HD6417750F167D | Renesas | RISC MPU, 32-BIT, 167MHZ | Microprocessors | N/A | N/A | N/A | N/A | 945 | |
 | | HD6417750RBP200V | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 1,327 | |
 | | HD6417750RF200DV | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 694 | |
 | | HD6417750RF200V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 98 | |
 | | HD6417750RX200DV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) | 178 | |
 | | HD6417750RX200V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 1,027 | |
 | | HD6417750RX240DV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) | 982 | |
 | | HD6417750RX240V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 841 | |
 | | HD6417750SBP200V | Renesas | 32-BIT RISC MICROPROCESSOR | Microprocessors | N/A | N/A | N/A | N/A | 795 | |
 | | HD6417750SF200V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.8V ~ 2.07V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 831 | |
 | | HD6417750SVF133V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 471 | |
 | N/A | HD6417750SVX133V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Operating Temperature: -20°C ~ 75°C (TA) | 1,653 | |
| N/A | N/A | HD6417750SX167V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) | 560 | |
| N/A | N/A | HD6417750SX200V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.8V ~ 2.07V Operating Temperature: -20°C ~ 75°C (TA) | 218 | |
 | | HD6417750VF128V | Renesas | RISC MPU, 32-BIT, 128MHZ | Microprocessors | N/A | N/A | N/A | N/A | 465 | |
| N/A | N/A | HD6417750X167V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) | 244 | |
 | | HD6417751RBP200 | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 288 | |
 | | HD6417751RBP200V | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 290 | |
 | | HD6417751RBP240D | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 608 | |
| N/A | | HD6417751RF200V | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | 256-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-HQFP (28×28) Package / Case: 256-BFQFP Exposed Pad | 1,271 | |