Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD64F3694GFPVHD64F3694GFPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
739
HD64F3694GFTVHD64F3694GFTVRenesasIC MCU 16BIT 32KB FLASH 48VQFNMicrocontrollers48-VQFN (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-VQFN (7×7)
Package / Case:
48-VFQFN
500
HD64F3694GFXVHD64F3694GFXVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (10×10)
Package / Case:
48-LQFP
571
HD64F3694GFYVHD64F3694GFYVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
826
HD64F3694GHVHD64F3694GHVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
172
HD64F3694HJHD64F3694HJRenesas16-BIT, FLASH, H8MicroprocessorsN/AN/AN/A

N/A

348
HD64F3694HVHD64F3694HVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,657
HD64F38024RDVHD64F38024RDVRenesasIC MCU 8BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
811
HD64F38024RFVHD64F38024RFVRenesasIC MCU 8BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×20)
Package / Case:
80-BQFP
544
HD64F38024RHVHD64F38024RHVRenesasIC MCU 8BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
368
HD64F38024RLPVHD64F38024RLPVRenesasIC MCU 8BIT 32KB FLASH 85TFLGAMicrocontrollers85-TFLGA (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
85-TFLGA (7×7)
Package / Case:
85-TFLGA
742
HD64F38024RWIVHD64F38024RWIVRenesasIC MCU 8BIT 32KB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,108
HD64F38024RWVHD64F38024RWVRenesasIC MCU 8BIT 32KB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
404
HD64F3854HHD64F3854HRenesasIC MCU 8BIT 60KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
24
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
666
HD64F3854HVHD64F3854HVRenesasIC MCU 8BIT 60KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
24
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,408
HD64F3857FQVHD64F3857FQVRenesasIC MCU 8BIT 60KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
35
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
114
HD64F7017F28VHD64F7017F28VRenesasIC MCU 32BIT 128KB FLASH 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
74
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
1,647
HD64F7017FI28VHD64F7017FI28VRenesasIC MCU 32BIT 128KB FLASH 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
74
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
967
HD64F7044F28VHD64F7044F28VRenesasIC MCU 32BIT 256KB FLASH 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
1,793
HD64F7045F28VHD64F7045F28VRenesasIC MCU 32BIT 256KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
379

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