Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD64F7045FI28VHD64F7045FI28VRenesasIC MCU 32BIT 256KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
40
HD64F7046F50VHD64F7046F50VRenesasIC MCU 32BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
1,509
HD64F7047F50VHD64F7047F50VRenesasIC MCU 32BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
644
HD64F7047FJ40VHD64F7047FJ40VRenesasIC MCU 32BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
134
N/AHD64F7047FL25Renesas32-BIT, FLASH, SH7000 CPUMicrocontrollersN/AN/AN/A

N/A

610
HD64F7047FW40VHD64F7047FW40VRenesasIC MCU 32BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
258
HD64F7051SFJ22HD64F7051SFJ22Renesas32-BIT, FLASH, SH7050 CPUMicrocontrollersN/AN/AN/A

N/A

1,350
HD64F7052FJ40HD64F7052FJ40RenesasRISC MICROCONTROLLER, 32 BIT, FLMicrocontrollersN/AN/AN/A

N/A

870
HD64F7052FJ40NHD64F7052FJ40NRenesas32-BIT, FLASH, SH7050 CPUMicrocontrollersN/AN/AN/A

N/A

181
HD64F7054FL40NHD64F7054FL40NRenesas32-BIT, FLASH, SH7050 CPUMicrocontrollersN/AN/AN/A

N/A

295
HD64F7065AF60VHD64F7065AF60VRenesasIC MCU 32BIT 256KB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
110
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
973
HD64F7144F50VHD64F7144F50VRenesasIC MCU 32BIT 256KB FLASH 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
766
HD64F7144FW50VHD64F7144FW50VRenesasIC MCU 32BIT 256KB FLASH 112QFPMicrocontrollers112-QFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
661
HD64F7145F50VHD64F7145F50VRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
563
HD64F7145FW50VHD64F7145FW50VRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
363
HD64N3664FPIVHD64N3664FPIVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
27
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
814
HD64N3664FPVHD64N3664FPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
27
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
191
N/AN/AHD65244CF17TPLARenesasIC MCU FLASHMicrocontrollersN/AN/AN/A

N/A

862
N/AHD68HC000U-10RenesasHD68000 -MICROCONTROLLER 16 BIT,MicrocontrollersN/AN/AN/A

N/A

1,483
HD68HC000UCP10HD68HC000UCP10RenesasMCU 16-BIT, GENERALMicrocontrollersN/AN/AN/A

N/A

1,120

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