Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD6417041AF28VHD6417041AF28VRenesasIC MCU 32BIT ROMLESS 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
188
HD6417041AVF16VHD6417041AVF16VRenesasIC MCU 32BIT ROMLESS 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
28.7MHz
Connectivity:
EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
517
HD6417144F50VHD6417144F50VRenesasIC MCU 32BIT ROMLESS 112QFPMicrocontrollers112-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-QFP (20×20)
Package / Case:
112-BQFP
727
HD6417145F50VHD6417145F50VRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,042
HD6417145FW50VHD6417145FW50VRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
98
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,420
N/AN/AHD6417334F66BVRenesasIC MCU 3V 0K PB FREE 208FPMicrocontrollers-N/A–

N/A

1,192
HD6417604SF28HD6417604SF28RenesasRISC MCU, 32-BIT, SUPERH CPUMicrocontrollersN/AN/AN/A

N/A

44
HD6417604SVF20VHD6417604SVF20VRenesasRISC MCU, 32-BIT, SUPERH CPUMicrocontrollers-N/A–
Core Size:
32-Bit
1,218
N/AHD6417612RFVRenesasRISC MICROCONTROLLER, 32-BIT, 60MicrocontrollersN/AN/AN/A

N/A

718
HD6417615ARFHD6417615ARFRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
436
HD6417615ARFVHD6417615ARFVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
758
HD6417616RFVHD6417616RFVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
929
HD6417616SFVHD6417616SFVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
951
HD6417622F80VHD6417622F80VRenesasIC MCU 32BIT ROMLESSMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-DSP
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, SCI, USB
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.75V ~ 2.05V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
186
HD6417705BP100BVHD6417705BP100BVRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
1,155
HD6417705BP100VHD6417705BP100VRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
1,557
HD6417705F133BVHD6417705F133BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,573
HD6417706BP133VHD6417706BP133VRenesasRISC MCU, 133.34MHZMicrocontrollersN/AN/AN/A

N/A

841
HD6417707RF60AHD6417707RF60ARenesasIC MCU 32-BIT FLASHMicrocontrollers-N/A–
Core Size:
32-Bit
Program Memory Type:
FLASH
Mounting Type:
Surface Mount
742
HD6417708RF100AVHD6417708RF100AVRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
567

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up