 | | HD6417708SF60 | Renesas | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SmartCard Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 8 | |
 | N/A | HD6417710XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 1,455 | |
 | | HD6417712BPV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 869 | |
 | N/A | HD6417712XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 800 | |
| N/A | | HD6417713BPV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO, UART/USART Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 1,586 | |
 | N/A | HD6417713XV | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 222 | |
 | | HD6417720BP133CV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, I2C, IrDA, Memory Card, SCI, SD, SIO, SIM, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 24 | |
 | | HD6417727BP100CV | Renesas | IC MCU 32BIT ROMLESS 240LFBGA | Microcontrollers | 240-LFBGA (13x13) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-LFBGA (13×13) | 1,531 | |
 | | HD6417727BP160CV | Renesas | IC MCU 32BIT ROMLESS 240LFBGA | Microcontrollers | 240-LFBGA (13x13) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-LFBGA (13×13) | 1,102 | |
 | | HD6417727X100CV | Renesas | IC MCU 32BIT ROMLESS 240HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 576 | |
 | | HD6417727X160CV | Renesas | IC MCU 32BIT ROMLESS 240HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: FIFO, SCI, SIO, SmartCard, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 2.05V Data Converters: A/D 6x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 409 | |
 | | HD6417750BP200M | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 406 | |
 | | HD6417750BP200MV | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 1,425 | |
 | | HD6417750F167 | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 1,582 | |
 | | HD6417750F167D | Renesas | RISC MPU, 32-BIT, 167MHZ | Microprocessors | QFP | N/A | 0 °C – 70 °C | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 1 Core, 32-Bit | 119 | |
 | | HD6417750RBP200V | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 955 | |
 | | HD6417750RF200DV | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 850 | |
 | | HD6417750RF200V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 1,534 | |
 | | HD6417750RX200DV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) | 201 | |
 | | HD6417750RX200V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 297 | |