Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HEF4952BT,112HEF4952BT,112NXP SemiconductorsIC MUX 8:2 360OHM 16SOAnalog Switches, Multiplexers, Demultiplexers16-SON/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:2
Number of Circuits:
1
On-State Resistance (Max):
360Ohm
Channel-to-Channel Matching (ΔRon):
10Ohm
Voltage – Supply, Single (V+):
5V ~ 15V
Voltage – Supply, Dual (V±):
±15V
Channel Capacitance (CS(off), CD(off)):
7.5pF
Current – Leakage (IS(off)) (Max):
200nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
416
HEF4952BT,118HEF4952BT,118NXP SemiconductorsIC MUX 8:2 360OHM 16SOAnalog Switches, Multiplexers, Demultiplexers16-SON/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:2
Number of Circuits:
1
On-State Resistance (Max):
360Ohm
Channel-to-Channel Matching (ΔRon):
10Ohm
Voltage – Supply, Single (V+):
5V ~ 15V
Voltage – Supply, Dual (V±):
±15V
Channel Capacitance (CS(off), CD(off)):
7.5pF
Current – Leakage (IS(off)) (Max):
200nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
450
N/AHH80547RE061CNIntelIC MPU 326 2.53GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A67.7°C (TC)
Core Processor:
Intel® Celeron® D Processor 326
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
2.53GHz
Voltage – I/O:
1.25V, 1.4V
Operating Temperature:
67.7°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
339
N/AHH80547RE067CNIntelIC MPU 331 2.66GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A67.7°C (TC)
Core Processor:
Intel® Celeron® D Processor 331
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
2.66GHz
Voltage – I/O:
1.25V, 1.4V
Operating Temperature:
67.7°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
1,529
N/AHH80547RE072CNIntelIC MPU 336 2.8GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A67.7°C (TC)
Core Processor:
Intel® Celeron® D Processor 336
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
2.8GHz
Voltage – I/O:
1.25V, 1.4V
Operating Temperature:
67.7°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
1,027
N/AHH80547RE093CNIntelIC MPU 355 3.33GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A67.7°C (TC)
Core Processor:
Intel® Celeron® D Processor 355
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3.33GHz
Voltage – I/O:
1.25V, 1.4V
Operating Temperature:
67.7°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
590
N/AHH80552PG0802MIntelIC MPU 631 3GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A69.2°C (TC)
Core Processor:
Intel® Pentium® 4 Processor 631 supporting HT Technology
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3GHz
Voltage – I/O:
1.2V, 1.3375V
Operating Temperature:
69.2°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
1,742
N/AHH80552PG0882MIntelIC MPU 641 3.2GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A69.2°C (TC)
Core Processor:
Intel® Pentium® 4 Processor 641 supporting HT Technology
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3.2GHz
Voltage – I/O:
1.2V, 1.3375V
Operating Temperature:
69.2°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
619
N/AHH80552RE083512IntelIC MPU INTEL CEL 3.06GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A69.2°C (TC)
Core Processor:
Intel® Celeron® D Processor 347
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
3.06GHz
Voltage – I/O:
1.25V, 1.325V
Operating Temperature:
69.2°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-BLGA
Supplier Device Package:
775-LGA (37.5×37.5)
699
HI1-0201-4HI1-0201-4RenesasIC SW SPST-NCX4 80OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A-25°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
80Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
180ns, 220ns
Channel Capacitance (CS(off), CD(off)):
5.5pF, 5.5pF
Current – Leakage (IS(off)) (Max):
50nA
Operating Temperature:
-25°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
535
HI1-0201-5HI1-0201-5RenesasIC SW SPST-NCX4 80OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A0°C ~ 75°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
80Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
180ns, 220ns
Channel Capacitance (CS(off), CD(off)):
5.5pF, 5.5pF
Current – Leakage (IS(off)) (Max):
50nA
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
8
HI1-0201HS-4HI1-0201HS-4RenesasIC SW SPST-NCX4 50OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A-25°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
50Ohm
Channel-to-Channel Matching (ΔRon):
1.5Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
50ns, 50ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
10pF, 10pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-86dB @ 100kHz
Operating Temperature:
-25°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
1,368
HI1-0201HS-5HI1-0201HS-5RenesasIC SW SPST-NCX4 50OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A0°C ~ 75°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
50Ohm
Channel-to-Channel Matching (ΔRon):
1.5Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
50ns, 50ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
10pF, 10pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-86dB @ 100kHz
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
994
HI1-0201HS/883BHI1-0201HS/883BAnalog Devices Inc.IC SWITCH SPST-NCX4 50OHM 16CDIPAnalog Switches, Multiplexers, Demultiplexers16-CDIPN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
50Ohm
Voltage – Supply, Single (V+):
12V ~ 20V
Voltage – Supply, Dual (V±):
±5V ~ 20V
Switch Time (Ton, Toff) (Max):
50ns, 50ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
10pF, 10pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CDIP
612
HI1-0303-5HI1-0303-5RenesasIC SWITCH SPDTX2 50OHM 14CERDIPAnalog Switches, Multiplexers, Demultiplexers14-CERDIPN/A0°C ~ 75°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
50Ohm
Voltage – Supply, Single (V+):
5V ~ 34V
Voltage – Supply, Dual (V±):
±5V ~ 20V
Switch Time (Ton, Toff) (Max):
300ns, 250ns
Charge Injection:
30pC
Channel Capacitance (CS(off), CD(off)):
16pF, 14pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
14-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
14-CERDIP
648
HI1-0390-2HI1-0390-2RenesasIC SWITCH SPDTX2 50OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
50Ohm
Voltage – Supply, Single (V+):
5V ~ 34V
Voltage – Supply, Dual (V±):
±5V ~ 20V
Switch Time (Ton, Toff) (Max):
300ns, 250ns
Charge Injection:
30pC
Channel Capacitance (CS(off), CD(off)):
16pF, 14pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
5
HI1-0506-5HI1-0506-5RenesasIC MUX 16:1 400OHM 28CERDIPAnalog Switches, Multiplexers, Demultiplexers28-CerDipN/A0°C ~ 75°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
400Ohm
Channel-to-Channel Matching (ΔRon):
20Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
250ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
10pF, 52pF
Current – Leakage (IS(off)) (Max):
30pA (Typ)
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-CDIP (0.600″”, 15.24mm)
Supplier Device Package:
28-CerDip
1,147
HI1-0506A-5HI1-0506A-5RenesasIC MUX 16:1 1.8KOHM 28CERDIPAnalog Switches, Multiplexers, Demultiplexers28-CerDipN/A0°C ~ 75°C (TA)
Multiplexer/Demultiplexer Circuit:
16:1
Number of Circuits:
1
On-State Resistance (Max):
1.8kOhm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
500ns, 500ns
Channel Capacitance (CS(off), CD(off)):
10pF, 52pF
Current – Leakage (IS(off)) (Max):
30pA (Typ)
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-CDIP (0.600″”, 15.24mm)
Supplier Device Package:
28-CerDip
1,153
HI1-0507-2HI1-0507-2RenesasIC MUX DUAL 8:1 300OHM 28CERDIPAnalog Switches, Multiplexers, Demultiplexers28-CerDipN/A-55°C ~ 125°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
2
On-State Resistance (Max):
300Ohm
Channel-to-Channel Matching (ΔRon):
15Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
500ns, 500ns
Channel Capacitance (CS(off), CD(off)):
10pF, 30pF
Current – Leakage (IS(off)) (Max):
30pA (Typ)
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
28-CDIP (0.600″”, 15.24mm)
Supplier Device Package:
28-CerDip
1,387
HI1-0508-5HI1-0508-5RenesasIC MUX 8:1 400OHM 16CERDIPAnalog Switches, Multiplexers, Demultiplexers16-CERDIPN/A0°C ~ 75°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
400Ohm
Channel-to-Channel Matching (ΔRon):
20Ohm
Voltage – Supply, Dual (V±):
±15V
Switch Time (Ton, Toff) (Max):
250ns, 250ns (Typ)
Channel Capacitance (CS(off), CD(off)):
10pF, 17pF
Current – Leakage (IS(off)) (Max):
30pA (Typ)
Operating Temperature:
0°C ~ 75°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CERDIP
387

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