 | | HD6417750RX240DV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) | 969 | |
 | | HD6417750RX240V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 44 | |
 | | HD6417750SBP200V | Renesas | 32-BIT RISC MICROPROCESSOR | Microprocessors | BGA | N/A | 0 °C – 70 °C | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 1 Core, 32-Bit | 928 | |
 | | HD6417750SF200V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.8V ~ 2.07V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 1,358 | |
 | | HD6417750SVF133V | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 814 | |
 | N/A | HD6417750SVX133V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Operating Temperature: -20°C ~ 75°C (TA) | 32 | |
| N/A | N/A | HD6417750SX167V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) | 1,094 | |
| N/A | N/A | HD6417750SX200V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.8V ~ 2.07V Operating Temperature: -20°C ~ 75°C (TA) | 918 | |
 | | HD6417750VF128V | Renesas | RISC MPU, 32-BIT, 128MHZ | Microprocessors | VFBGA | N/A | 0 °C – 70 °C | Voltage – I/O: 1.8 V – 3.3 V Number of Cores/Bus Width: 1 Core, 32-Bit | 1,363 | |
| N/A | N/A | HD6417750X167V | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) | 330 | |
 | | HD6417751RBP200 | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 738 | |
 | | HD6417751RBP200V | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 110 | |
 | | HD6417751RBP240D | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 1,349 | |
| N/A | | HD6417751RF200V | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | 256-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-HQFP (28×28) Package / Case: 256-BFQFP Exposed Pad | 381 | |
| N/A | | HD6417751RX200V | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 492 | |
 | | HD6417751RX240V | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -20°C ~ 75°C (TA) | 65 | |
| N/A | N/A | HD6417751X167V | Renesas | IC MCU 32BIT ROMLESS 256HQFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.6V ~ 2V Operating Temperature: -20°C ~ 75°C (TA) | 1,724 | |
 | | HD6417760BL200AV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 327 | |
 | | HD64180F10F | Renesas | 8-BIT MICROPROCESSOR | Microprocessors | QFP | N/A | 0 °C – 70 °C | Number of Cores/Bus Width: 1 Core, 8-Bit | 1,248 | |
 | | HD64180R1CP8 | Renesas | 8-BIT MICROPROCESSOR | Microprocessors | CDIP | N/A | 0 °C – 70 °C | Number of Cores/Bus Width: 1 Core, 8-Bit | 807 | |