 | | LPC2214FBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 934 | |
 | | LPC2214FBD144/01,5 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 268 | |
 | | LPC2214FBD144/01K | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 588 | |
 | | LPC2220FBD144,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,290 | |
 | | LPC2220FET144/G,51 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) | 333 | |
 | | LPC2220FET144/G,55 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) | 90 | |
 | | LPC2290FBD144,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,082 | |
 | | LPC2290FBD144/01,5 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 799 | |
 | | LPC2292FBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 324 | |
 | | LPC2292FBD144/01,5 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,027 | |
 | | LPC2292FET144,551 | NXP Semiconductors | IC MCU 16/32BIT 256KB 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) | 1,550 | |
 | | LPC2292FET144/01,5 | NXP Semiconductors | IC MCU 16/32BIT 256KB 144TFBGA | Microcontrollers | 144-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TFBGA (12×12) | 117 | |
 | | LPC2294HBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 286 | |
 | | LPC2294HBD144/01,5 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 219 | |
 | | LPC2294HBD144/01K | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 648 | |
 | | LPC2294JBD144,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,314 | |
 | | LPC2361FBD100,551 | NXP Semiconductors | IC MCU 16/32B 64KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 586 | |
 | | LPC2362FBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 203 | |
 | | LPC2364FBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 300 | |
 | | LPC2364FBD100K | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 640 | |