 | | LPC2364FET100,518 | NXP Semiconductors | IC MCU 16/32BIT 128KB 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,649 | |
 | | LPC2364HBD100,551 | NXP Semiconductors | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 608 | |
 | | LPC2365FBD100,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,156 | |
 | | LPC2366FBD100,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 158 | |
 | | LPC2366FBD100K | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 236 | |
 | | LPC2367FBD100,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 264 | |
| N/A | | LPC2368FBD100,518 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7TDMI-S Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,571 | |
 | | LPC2368FBD100,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,175 | |
 | | LPC2368FBD100K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,223 | |
 | | LPC2368FET100,518 | NXP Semiconductors | IC MCU 16/32BIT 512KB 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,188 | |
 | | LPC2377FBD144,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 15 | |
 | | LPC2378FBD144,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 327 | |
 | | LPC2378FBD144K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b SAR; D/A 1x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 553 | |
 | | LPC2387FBD100,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 230 | |
 | | LPC2387FBD100K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 817 | |
 | | LPC2388FBD144,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 70 | |
 | | LPC2388FBD144K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 574 | |
 | | LPC2420FBD208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 767 | |
 | | LPC2420FBD208K | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 743 | |
 | | LPC2420FET208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 812 | |