 | | LPC2926FBD144,551 | NXP Semiconductors | LPC2900 - Arm9, 32-Bit RISC Micr | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 24x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 888 | |
 | | LPC2926FBD144,557 | NXP Semiconductors | LPC2926FBD144 - ARM9 microcontro | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 24x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 823 | |
 | | LPC2927FBD144,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 513 | |
 | | LPC2929FBD144,551 | NXP Semiconductors | IC MCU 16/32B 768KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 476 | |
 | | LPC2930FBD208,551 | NXP Semiconductors | LPC2900 - Arm9, 32-Bit RISC Micr | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 24x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 559 | |
 | | LPC2939FBD208,551 | NXP Semiconductors | IC MCU 16/32B 768KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 690 | |
 | N/A | LPC2939FET208,551 | NXP Semiconductors | IC MCU 16/32B 768KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 386 | |
 | | LPC3130FET180,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 540 | |
| N/A | | LPC3131FET180,551 | NXP Semiconductors | LPC3131 - Low-cost, low-power AR | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.2V ~ 3.6V Data Converters: A/D 4x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,265 | |
 | | LPC3141FET180,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 98 | |
 | | LPC3143FET180,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,442 | |
 | | LPC3152FET208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (12×12) | 442 | |
 | | LPC3154FET208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (12×12) | 433 | |
 | | LPC3180FEL320/01,5 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 320LFBGA | Microcontrollers | 320-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG Peripherals: DMA, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.1V ~ 3.3V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (13×13) | 962 | |
 | | LPC3220FET296/01,5 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 98 | |
| N/A | | LPC3220FET296/01K | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 1,502 | |
 | | LPC3230FET296/01,5 | NXP Semiconductors | LPC3230 - Arm9, 32-Bit Microcont | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 620 | |
 | | LPC3240FET296,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 487 | |
 | | LPC3240FET296/01,5 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 1,113 | |
 | | LPC3240FET296/01K | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 427 | |