Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC2926FBD144,551LPC2926FBD144,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
888
LPC2926FBD144,557LPC2926FBD144,557NXP SemiconductorsLPC2926FBD144 - ARM9 microcontroMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
823
LPC2927FBD144,551LPC2927FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
513
LPC2929FBD144,551LPC2929FBD144,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
476
LPC2930FBD208,551LPC2930FBD208,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Type:
ROMless
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
559
LPC2939FBD208,551LPC2939FBD208,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
690
LPC2939FET208,551N/ALPC2939FET208,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
386
LPC3130FET180,551LPC3130FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
540
N/ALPC3131FET180,551NXP SemiconductorsLPC3131 - Low-cost, low-power ARMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.2V ~ 3.6V
Data Converters:
A/D 4x10b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,265
LPC3141FET180,551LPC3141FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
270MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
20
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
98
LPC3143FET180,551LPC3143FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
270MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
20
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,442
LPC3152FET208,551LPC3152FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
10
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
442
LPC3154FET208,551LPC3154FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
10
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
433
LPC3180FEL320/01,5LPC3180FEL320/01,5NXP SemiconductorsIC MCU 16/32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
208MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
55
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.3V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (13×13)
Package / Case:
320-LFBGA
962
LPC3220FET296/01,5LPC3220FET296/01,5NXP SemiconductorsIC MCU 16/32BIT ROMLESS 296TFBGAMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
98
N/ALPC3220FET296/01KNXP SemiconductorsIC MCU 16/32BIT ROMLESS 296TFBGAMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
1,502
LPC3230FET296/01,5LPC3230FET296/01,5NXP SemiconductorsLPC3230 - Arm9, 32-Bit MicrocontMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
620
LPC3240FET296,551LPC3240FET296,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 296TFBGAMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
487
LPC3240FET296/01,5LPC3240FET296/01,5NXP SemiconductorsIC MCU 16/32BIT ROMLESS 296TFBGAMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
1,113
LPC3240FET296/01KLPC3240FET296/01KNXP SemiconductorsIC MCU 16/32BIT ROMLESS 296TFBGAMicrocontrollers296-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
266MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
DMA, I2S, Motor Control PWM, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
0.9V ~ 3.6V
Data Converters:
A/D 3x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
296-TFBGA (15×15)
Package / Case:
296-TFBGA
427

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up