 | | LPC3250FET296,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 1,677 | |
 | | LPC3250FET296/01,5 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 1,183 | |
 | | LPC3250FET296/01K | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 296TFBGA | Microcontrollers | 296-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Data Converters: A/D 3x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 296-TFBGA (15×15) | 334 | |
 | | LPC4072FBD80E | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 251 | |
| N/A | | LPC4072FET80K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 80TFBGA | Microcontrollers | 80-TFBGA (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-TFBGA (7×7) | 602 | |
 | | LPC4074FBD144,551 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 967 | |
 | | LPC4074FBD80,551 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 866 | |
 | | LPC4076FBD144E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,484 | |
| N/A | N/A | LPC4076FET180 | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12bSAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 330 | |
 | | LPC4076FET180,551 | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 870 | |
 | N/A | LPC4076FET180K | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 417 | |
 | | LPC4078FBD100E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 629 | |
 | | LPC4078FBD100K | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 282 | |
| N/A | | LPC4078FBD144,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,471 | |
 | | LPC4078FBD208,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 627 | |
 | | LPC4078FBD80,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,096 | |
 | | LPC4078FET180,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 474 | |
 | | LPC4078FET180K | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,313 | |
 | | LPC4078FET208,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 639 | |
 | | LPC4078FET208K | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 1,550 | |