 | | LPC4088FBD144,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,179 | |
 | | LPC4088FBD208,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,045 | |
 | | LPC4088FBD208K | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 349 | |
 | | LPC4088FET180,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 285 | |
 | | LPC4088FET208,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 547 | |
 | | LPC4310FBD144,551 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,751 | |
 | | LPC4310FET100,551 | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 479 | |
 | | LPC4312JBD144E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,460 | |
 | | LPC4312JET100E | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 813 | |
 | | LPC4313JBD144E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 953 | |
 | | LPC4313JET100E | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 324 | |
 | | LPC4315JBD144E | NXP Semiconductors | IC MCU 32BIT 768KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 259 | |
 | | LPC4315JET100E | NXP Semiconductors | IC MCU 32BIT 768KB FLSH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,920 | |
 | | LPC4317JBD144E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,713 | |
 | | LPC4317JET100E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 868 | |
| N/A | | LPC4320FBD144,551 | NXP Semiconductors | LPC4300 - 32-Bit RISC Microcontr | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 890 | |
 | | LPC4320FET100,551 | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 861 | |
 | | LPC4322JBD144E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 761 | |
 | | LPC4322JET100E | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 507 | |
 | | LPC4323JBD144E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,558 | |