 | | LPC2458FET180,551 | NXP Semiconductors | IC MCU 16/32BIT 512KB 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 510 | |
 | | LPC2460FBD208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,067 | |
 | | LPC2460FET208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 546 | |
| N/A | | LPC2460FET208Y | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM7TDMI-S Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 1,329 | |
 | | LPC2468FBD208,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 36 | |
 | | LPC2468FBD208K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,465 | |
 | | LPC2468FET208,551 | NXP Semiconductors | IC MCU 16/32BIT 512KB 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 1,812 | |
 | | LPC2468FET208K | NXP Semiconductors | IC MCU 16/32BIT 512KB 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 162 | |
 | | LPC2470FBD208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 374 | |
 | | LPC2470FET208,551 | NXP Semiconductors | IC MCU 16/32BIT ROMLESS 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 791 | |
 | | LPC2478FBD208,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 381 | |
 | | LPC2478FBD208K | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 252 | |
 | | LPC2478FET208,551 | NXP Semiconductors | IC MCU 16/32BIT 512KB 208TFBGA | Microcontrollers | 208-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TFBGA (15×15) | 1,952 | |
 | | LPC2917FBD144,551 | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 751 | |
 | | LPC2917FBD144/01/, | NXP Semiconductors | IC MCU 16/32B 512KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 566 | |
 | | LPC2919FBD144,551 | NXP Semiconductors | IC MCU 16/32B 768KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,803 | |
 | | LPC2919FBD144/01/, | NXP Semiconductors | IC MCU 16/32B 768KB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 830 | |
 | | LPC2921FBD100,551 | NXP Semiconductors | LPC2900 - Arm9, 32-Bit RISC Micr | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 26 | |
 | | LPC2923FBD100,551 | NXP Semiconductors | IC MCU 16/32B 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 315 | |
| N/A | | LPC2925FBD100,551 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V Data Converters: A/D 16x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 611 | |