Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC2458FET180,551LPC2458FET180,551NXP SemiconductorsIC MCU 16/32BIT 512KB 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
510
LPC2460FBD208,551LPC2460FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,067
LPC2460FET208,551LPC2460FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
546
N/ALPC2460FET208YNXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7TDMI-S
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
1,329
LPC2468FBD208,551LPC2468FBD208,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
36
LPC2468FBD208KLPC2468FBD208KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,465
LPC2468FET208,551LPC2468FET208,551NXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
1,812
LPC2468FET208KLPC2468FET208KNXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
162
LPC2470FBD208,551LPC2470FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
374
LPC2470FET208,551LPC2470FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
791
LPC2478FBD208,551LPC2478FBD208,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
381
LPC2478FBD208KLPC2478FBD208KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
252
LPC2478FET208,551LPC2478FET208,551NXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
1,952
LPC2917FBD144,551LPC2917FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
751
LPC2917FBD144/01/,LPC2917FBD144/01/,NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
566
LPC2919FBD144,551LPC2919FBD144,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,803
LPC2919FBD144/01/,LPC2919FBD144/01/,NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
830
LPC2921FBD100,551LPC2921FBD100,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
26
LPC2923FBD100,551LPC2923FBD100,551NXP SemiconductorsIC MCU 16/32B 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
315
N/ALPC2925FBD100,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
611

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