Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AM0L1305QDGS28RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers28-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
32KB (32K x 8)
Mounting Type:
Surface Mount
1,791
N/AM0L1305QDYYRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers16-SOT-23-THINN/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
13
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 6x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOT-23-THIN
Package / Case:
SOT-23-16 Thin, SOT-23 Variant
340
N/AM0L1305QRGERQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers24-VQFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
20
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
24-VQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
168
M0L1305QRHBRQ1M0L1305QRHBRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
787
N/AN/AM0L1306QDGS20RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers20-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
992
N/AN/AM0L1306QDGS28RQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers28-VSSOP1.62V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
698
N/AM0L1306QDYYRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers16-SOT-23-THINN/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
13
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 6x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOT-23-THIN
Package / Case:
SOT-23-16 Thin, SOT-23 Variant
1,524
N/AM0L1306QRGERQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers24-VQFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
20
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 9x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
24-VQFN (4×4)
Package / Case:
24-VFQFN Exposed Pad
56
M0L1306QRHBRQ1M0L1306QRHBRQ1Texas InstrumentsAUTOMOTIVE 32-MHZ ARM CORTEX-M0+Microcontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 10x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,184
N/AM12L128168A (2S)ESMT128Mb SDRAM Ind.DRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
448
N/AM12L128168A-5BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
128
N/AM12L128168A-5TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
838
N/AM12L128168A-6BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
192
N/AM12L128168A-6TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
108
N/AM12L128168A-7BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
664
N/AM12L128168A-7TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
706
N/AM12L128324A-5BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
1,707
N/AM12L128324A-6BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
48
N/AM12L128324A-7BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
221
N/AM12L16161A-5T(2R)ESMT16Mb SDRAM Ind.DRAM Memory50PIN TSOP2.5V-40°C – 85°C
Memory Size:
16 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
50PIN TSOP
504

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